المؤلفون: Liu, You, Liu, Tongshan, Shi, Rui, Gao, Yan, Wang, Jingxian, Xu, Fang, Yang, Jiyuan

المصدر: 2024 9th International Conference on Computer and Communication Systems (ICCCS) Computer and Communication Systems (ICCCS), 2024 9th International Conference on. :56-60 Apr, 2024

Relation: 2024 9th International Conference on Computer and Communication Systems (ICCCS)

المؤلفون: Chen, Zhi, Du, Cuifeng, Huang, Xiujie, Lin, Zelong, Zhou, Yuyu, Guan, Quanlong, Li, Zhefu, Lv, Shuanghuan, Wu, Xiaofeng, Zhuang, Xiaotian

المصدر: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) Acoustics, Speech and Signal Processing (ICASSP), ICASSP 2024 - 2024 IEEE International Conference on. :5815-5819 Apr, 2024

Relation: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)

المؤلفون: Gao, Yan, Zhang, Yizhong, Ma, Yuhui^{Aff2, Aff3, IDs1339902202936w_cor3}

المصدر: Biomass Conversion and Biorefinery: Processing of Biogenic Material for Energy and Chemistry. 14(7):8877-8894

المؤلفون: Siti Zulaikah, Farid Triawan, Bentang Arief Budiman, Yusuf Romadhon

المصدر: Rekayasa Mesin, Vol 15, Iss 2, Pp 901-910 (2024)

مصطلحات موضوعية: massage chair, corrugated cardboard, solid rubber balls, reclining seat, design and fabrication, strength, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://rekayasamesin.ub.ac.id/index.php/rm/article/view/1593; https://doaj.org/toc/2338-1663; https://doaj.org/toc/2477-6041

URL الوصول: https://doaj.org/article/20a2b63a8424454386261dd43957639e

المؤلفون: Hwang, Sungjun^{Aff1, Aff2, IDs1057002305613x_cor1}, Walker, Colleen C., Ozcan, Soydan, Tekinalp, Halil, Han, Yousoo^{Aff1, Aff2}, Gardner, Douglas J.^{Aff1, Aff2}

المصدر: Cellulose. 31(1):263-277

المؤلفون: Florin Ionut Boaca, Sorin Cananau, Andrei Calin, Delia Prisecaru, Marilena Stoica

المصدر: Journal of Research and Innovation for Sustainable Society, Vol 6, Iss 1, Pp 41-46 (2024)

مصطلحات موضوعية: mechanical strength, corrugated cardboard, tangential stresses, stress distribution., Technology, Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: https://jriss.4ader.ro/wp-content/uploads/2024/04/05_F-I-Boaca-S-Cananau-A-Calin-D-Prisecaru-M-Stoica-SHEAR-TEST-OF-CORRUGATED-BOARD.pdf; https://doaj.org/toc/2668-0416

URL الوصول: https://doaj.org/article/c161ae7831c9403696d46eab304901dc

المؤلفون: Morioka, Yosuke^Aff3, Kaneko, Tetsuo^Aff3

المساهمون: Xhafa, Fatos, Series Editor^Aff1, Takenouchi, Kazuki, editor^Aff2

المصدر: ICGG 2024 - Proceedings of the 21st International Conference on Geometry and Graphics : Volume 3. 218:413-416

المؤلفون: Kacper Andrzejak, Damian Mrówczyński, Tomasz Gajewski, Tomasz Garbowski

المصدر: Materials, Vol 17, Iss 17, p 4205 (2024)

مصطلحات موضوعية: corrugated cardboard, perforations, box compression test, finite element method, strength analysis, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/17/17/4205; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/430dc9db1a39407bb2cf28f7c4e0bfea

المؤلفون: Tomasz Jóźwiak, Urszula Filipkowska, Anna Bednarowicz, Dorota Zielińska, Maria Wiśniewska-Wrona

المصدر: Molecules, Vol 29, Iss 12, p 2809 (2024)

مصطلحات موضوعية: waste paper, newsprint, LWC, office paper, corrugated cardboard, unconventional sorbent, Organic chemistry, QD241-441

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1420-3049/29/12/2809; https://doaj.org/toc/1420-3049

URL الوصول: https://doaj.org/article/4b6a9d723df147269ac0c792f2bba574

المؤلفون: Suppitaksakul, Chatchai, Suwannakit, Wanida

المصدر: 2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON), 2018 15th International Conference on. :262-265 Jul, 2018

Relation: 2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)