يعرض 1 - 7 نتائج من 7 نتيجة بحث عن '"Cosnier, Thibault"', وقت الاستعلام: 0.87s تنقيح النتائج
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    مؤتمر

    المصدر: ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2022 - IEEE 52nd European. :245-248 Sep, 2022

    Relation: ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC)

  2. 2
    مؤتمر

    المصدر: 2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME) Ph.D Research in Microelectronics and Electronics (PRIME), 2022 17th Conference on. :273-276 Jun, 2022

    Relation: 2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)

  3. 3
    مؤتمر

    المصدر: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020 21st International Conference on. :1-6 Jul, 2020

    Relation: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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    المساهمون: Cosnier, Thibault, Université Grenoble Alpes [2016-2019] (UGA [2016-2019]), Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Centre de Nanosciences et de Nanotechnologies (C2N), Université Paris-Saclay-Centre National de la Recherche Scientifique (CNRS), C2N, CNRS - Université Paris-Sud, Université Paris-Saclay

    المصدر: HAL
    2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
    2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Sep 2017, Kamakura, Japan

    وصف الملف: application/pdf