المؤلفون: Garnier, Arnaud, Castagne, Laetitia, Moreau, Stephane, Fraczkiewicz, Alexandra, Monniez, Theo, Mermin, Daniel, Guillou, Suzanne, Vauche, Laura, Saint-Patrice, Damien, Coudrain, Perceval

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1649-1656 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Misat, Sylvain, Loktev, Mikhail, Schiedon, Ralph, De Boeij, Jeroen, van der Stam, Michiel, Huang, Chia-Ching, Sixt, Pierre, Al Dujaili, Haidar, Dewolf, Tristan, Allouti, Nacima, Pain, Laurent, Vannuffel, Cyril, Coudrain, Perceval, Garnier, Arnaud

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :867-872 Dec, 2022

Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Plihon, Aurelia, Deschaseaux, Edouard, Franiatte, Remi, Dechamp, Jerome, Vaudaine, Simon, Guillaume, Jennifer, Brunet-Manquat, Catherine, Moreau, Stephane, Coudrain, Perceval

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2122-2127 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Loktev, Mikhail, Misat, Sylvain I., Schiedon, Ralph, de Boeij, Jeroen, van der Stam, Michiel, Sixt, Pierre, Dujaili, Haidar Al, Dewolf, Tristan, Allouti, Nacima, Pain, Laurent, Vannuffel, Cyril, Coudrain, Perceval, Garnier, Arnaud

المصدر: 2022 Smart Systems Integration (SSI) Smart Systems Integration (SSI), 2022. :1-6 Apr, 2022

Relation: 2022 Smart Systems Integration (SSI)

المؤلفون: Garnier, Arnaud, Castagne, Laetitia, Greco, Florent, Guillemet, Thomas, Marechal, Laurent, Neffati, Mehdy, Franiatte, Remi, Coudrain, Perceval, Piotrowicz, Stephane, Simon, Gilles

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2016-2023 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Struss, Quentin, Coudrain, Perceval, Colonna, Jean-Philippe, Souifi, Abdelkader, Gontrand, Christian, Deschaseaux, Edouard, Mauguen, Gaelle, Mathieu, Vincent, Magis, Thomas, Simon, Gilles, Frechette, Luc G.

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :2259-2265 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Vivet, Pascal, Guthmuller, Eric, Thonnart, Yvain, Pillonnet, Gael, Moritz, Guillaume, Miro-Panades, Ivan, Fuguet, Cesar, Durupt, Jean, Bernard, Christian, Varreau, Didier, Pontes, Julian, Thuries, Sebastien, Coriat, David, Harrand, Michel, Dutoit, Denis, Lattard, Didier, Arnaud, Lucile, Charbonnier, Jean, Coudrain, Perceval, Garnier, Arnaud, Berger, Frederic, Gueugnot, Alain, Greiner, Alain, Meunier, Quentin, Farcy, Alexis, Arriordaz, Alexandre, Cheramy, Severine, Clermidy, Fabien

المصدر: 2020 IEEE International Solid-State Circuits Conference - (ISSCC) Solid-State Circuits Conference - (ISSCC), 2020 IEEE International. :46-48 Feb, 2020

Relation: 2020 IEEE International Solid-State Circuits Conference - (ISSCC)

المؤلفون: Cibie, Anthony, Widiez, Julie, Escoffier, Rene, Blachier, Denis, Vladimirova, Kremena, Colonna, Jean-Philippe, Haumesser, Paul-Henri, Becu, Stephane, Coudrain, Perceval, Vandendaele, William, Biscarrat, Jerome, Gillot, Charlotte, Charles, Matthew, Di Cioccio, Lea

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :168-174 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

المؤلفون: Coudrain, Perceval, Charbonnier, J., Garnier, A., Vivet, P., Velard, R., Vinci, A., Ponthenier, F., Farcy, A., Segaud, R., Chausse, P., Arnaud, L., Lattard, D., Guthmuller, E., Romano, G., Gueugnot, A., Berger, F., Beltritti, J., Mourier, T., Gottardi, M., Minoret, S., Ribiere, C., Romero, G., Philip, P.-E., Exbrayat, Y., Scevola, D., Campos, D., Argoud, M., Allouti, N., Eleouet, R., Fuguet Tortolero, C., Aumont, C., Dutoit, D., Legalland, C., Michailos, J., Cheramy, S., Simon, G.

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :569-578 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

المؤلفون: Struss, Quentin, Coudrain, Perceval, Colonna, Jean-Philippe, Souifi, Abdelkader, Goutrand, Christian, Frechette, Luc G.

المصدر: 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2018 24rd International Workshop on. :1-6 Sep, 2018

Relation: 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)