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المؤلفون: Lindsay Millar, Arjan Buis, Lin Meng, Craig Child
المصدر: EMBC
مصطلحات موضوعية: 030222 orthopedics, Motion analysis, medicine.medical_specialty, Computer science, 0206 medical engineering, Reproducibility of Results, 02 engineering and technology, Kinematics, Manipulation, Osteopathic, 020601 biomedical engineering, Gait, 03 medical and health sciences, 0302 clinical medicine, Gait (human), Physical medicine and rehabilitation, Gait analysis, medicine, Animals, Humans, Manipulation, Orthopedic, Range of Motion, Articular, Reliability (statistics)
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المؤلفون: Joseph F. Shepard, Henrik Johanson, Vandana Venkatasubramanian, Jay Mody, Takmeel Qanit, Ashwini Chandrasekar, Eswar Ramanathan, Craig Child, AnbuSelvam Km Mahalingam, Lei Jiang, Brett T. Cucci, Alycia Roux, O'brien Brendan, Christa Montgomery, Bradley Morganfeld, Keith Donegan, Colin Bombardier, Sang-Kee Eah, Vijaya Rana, Ghosh Somnath, Daniel Damjanovic, Anirvan Sircar, Zhiguo Sun, Singh Sunil K, Rebekah Sheraw, Ordonio Christopher, Silvestre MaryClaire, Adam DaSilva
المصدر: 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
مصطلحات موضوعية: Materials science, Etching (microfabrication), Chemical-mechanical planarization, Technology scaling, Nanotechnology, Thin film, Hard mask
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3b80f0efb35ac3f6be7ae230059a989a
https://doi.org/10.1109/asmc.2019.8791788 -
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المؤلفون: Martin O'Toole, Louis J. Lanzerotti, Atsushi Ogino, Terry A. Spooner, Sean Reidy, Craig Child, James Hsueh-Chung Chen, Lawrence A. Clevenger
المصدر: 2018 IEEE International Interconnect Technology Conference (IITC).
مصطلحات موضوعية: 010302 applied physics, Mandrel, Thin wire, Materials science, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, 02 engineering and technology, Topology, 01 natural sciences, Merge (version control), Lithography, 020202 computer hardware & architecture
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6e85de8449b179e3133293eb5c291861
https://doi.org/10.1109/iitc.2018.8430439 -
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المؤلفون: Dhruv Singh, A. Gassaria, V. Chauhan, A. da Silva, P. Lindo, Daniel J. Dechene, M. Gribelyuk, I. Ahsan, M. Hasan, Judson R. Holt, Rod Augur, Jaeger Daniel, G. Northrop, G. Gomba, Ghosh Somnath, H. Narisetty, Basanth Jagannathan, Ting-Hsiang Hung, P. Liu, Y. Zhong, T. Gordon, Y. Fan, C. Schiller, A. Blauberg, O. Patterson, B. Morganfeld, Andres Bryant, J. Choo, T. Nigam, B. Senapati, V. Sardesai, N. Baliga, C. An, I. Ramirez, Rishikesh Krishnan, Arkadiusz Malinowski, S. Lucarini, Z. Sun, Sadanand V. Deshpande, R. Bhelkar, Mahender Kumar, Kong Boon Yeap, D. Conklin, Q. Fang, R. Gauthier, Purushothaman Srinivasan, S. Crown, M. Ozbek, Linjun Cao, G. Han, Z. Song, L. Huang, C. Serrau, R. Sweeney, M. Tan, Keith Donegan, Souvick Mitra, A. Zainuddin, P. Agnello, Balasubramanian S. Haran, Haifeng Sheng, B. Greene, A. Hassan, Tabakman Keith, Xin Wang, Sanjay Parihar, L. Cheng, M. Lagus, Jessica Dechene, D. Xu, G. Gifford, M. Zhao, Jeyaraj Antony Johnson, Y. Yan, Rick Carter, Manoj Joshi, W. Kim, Gabriela Dilliway, Jack M. Higman, S. Kalaga, Kai Zhao, Jinping Liu, A. Ogino, M. Lipinski, Amanda L. Tessier, Garo Jacques Derderian, S. Madisetti, N. Shah, Christopher Ordonio, M. Aminpur, Rakesh Ranjan, S. Saudari, Christa Montgomery, Tony Tae-Hyoung Kim, Jeric Sarad, Jae Gon Lee, Bharat Krishnan, Joseph F. Shepard, L. Hu, J. Sporre, Akil K. Sutton, Eswar Ramanathan, Cathryn Christiansen, J.H. Han, J. Lemon, Patrick Justison, Natalia Borjemscaia, Scott C. Johnson, B. Cohen, Kan Zhang, Srikanth Samavedam, G. Xu, T. Xuan, Unoh Kwon, C. Meng, Katsunori Onishi, Y. Shi, C. Huang, R. Coleman, Manfred Eller, Shreesh Narasimha, B. Kannan, J. Yang, Vivek Joshi, W. Ma, Christopher D. Sheraw, A. K. M. Mahalingam, Craig Child, E. Woodard, Tao Chu, Y. Jin, D. K. Sohn, Hasan M. Nayfeh, Mary Claire Silvestre, M. Lingalugari, G. Biery, Tian Shen, Carl J. Radens, E. Kaste, C-H. Lin, K. Han, K. Anil, Ankur Arya, Mehta Jaladhi, Jia Zeng, S.L. Liew, Michael V. Aquilino, M. Yu, M. Chen, Rohit Pal, E. Maciejewski, Stephan Grunow, Robert Fox, Rinus T. P. Lee
المصدر: 2017 IEEE International Electron Devices Meeting (IEDM).
مصطلحات موضوعية: 010302 applied physics, Computer science, Extreme ultraviolet lithography, Process (computing), 02 engineering and technology, 021001 nanoscience & nanotechnology, Low voltage sram, 01 natural sciences, Capacitance, CMOS, Computer architecture, Logic gate, 0103 physical sciences, Leverage (statistics), 0210 nano-technology, Immersion lithography
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5545f519d7dcbb19a8a64d95e77053fd
https://doi.org/10.1109/iedm.2017.8268476 -
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المؤلفون: Chun Hui Low, Anbu Selvam Km Mahalingam, Ming He, DeNeil Park, Alycia Roux, Yue Zhou, Mert Karakoy, Daniel Fisher, Mary Claire Silvestre, Craig Child
المصدر: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
مصطلحات موضوعية: Interconnection, Yield (engineering), Materials science, Real-time computing, Process (computing), 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Engineering physics, 010309 optics, 0103 physical sciences, Macro, 0210 nano-technology, Critical dimension
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ce8c06de8656b2d11b892a74af58948c
https://doi.org/10.1109/asmc.2017.7969189 -
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المؤلفون: James Hsueh-Chung Chen, Terry A. Spooner, Martin O'Toole, Jason Eugene Stephens, Shreesh Narasimha, Ben Kim, Licausi Nicholas, Craig Child
المصدر: 2017 IEEE International Interconnect Technology Conference (IITC).
مصطلحات موضوعية: 010302 applied physics, Interconnection, Materials science, 02 engineering and technology, 01 natural sciences, Capacitance, 020202 computer hardware & architecture, Parasitic capacitance, 0103 physical sciences, Process integration, Line (geometry), 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Multiple patterning, Lithography, Block (data storage)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fb214faa90ea884f4e0d999979442ac2
https://doi.org/10.1109/iitc-amc.2017.7968943 -
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المؤلفون: Martin O'Toole, James Hsueh-Chung Chen, Shreesh Narasimha, Jason Eugene Stephens, Shao Beng Law, Genevieve Beique, Ben Kim, Craig Child, E. Todd Ryan, Steven Leibiger, Louis J. Lanzerotti, Terry A. Spooner
المصدر: 2017 IEEE International Interconnect Technology Conference (IITC).
مصطلحات موضوعية: 010302 applied physics, Materials science, business.industry, Optical engineering, Pillar, Nanotechnology, 01 natural sciences, Aspect ratio (image), Planarity testing, 010309 optics, Chemical-mechanical planarization, 0103 physical sciences, Multiple patterning, Optoelectronics, business, Layer (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4672fecbe6df4af021d44ffb253152cc
https://doi.org/10.1109/iitc-amc.2017.7968964 -
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المؤلفون: Shafaat Ahmed, Ketan Shah, Craig Child, Stephan Grunow, Dinesh Koli, Anbu Selvam Km Mahalingam, Adam da Silva, Tien-Jen Cheng, Mukta Sharma, Teng-Yin Lin
المصدر: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
مصطلحات موضوعية: Void (astronomy), Interconnection, Yield (engineering), Plating, Nucleation, Wafer, Composite material, Electroplating, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::298867b129379d7d6b064f65fb42d6cc
https://doi.org/10.1109/asmc.2017.7969191 -
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المؤلفون: Anbu Selvam Km Mahalingam, San Leong Liew, Prakash Periasamy, Craig Child, Jeric Sarad, Adam da Silva
المصدر: 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
مصطلحات موضوعية: Interconnection, Materials science, business.industry, Annealing (metallurgy), Design of experiments, chemistry.chemical_element, Current ramp, Copper, Electromigration, chemistry, Technology scaling, Electronic engineering, Optoelectronics, Undercut, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5993c83a5f8ba70ff08c0ddedd79d82b
https://doi.org/10.1109/asmc.2016.7491147 -
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المؤلفون: Aleksandra Clancy, Ayman Hamouda, Ashwini Chandrasekhar, Shyam Pal, Jeff Shu, Christopher Ordonio, Jason Eugene Stephens, Chun Hui Low, Ming He, Prakash Periasamy, Mary Claire Silvestre, Anbu Selvam Km Mahalingam, Peter Welti, Craig Child, Granger Lobb, Ketan Shah
المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).
مصطلحات موضوعية: Standard cell, Interconnection, Atomic layer deposition, Materials science, Technology scaling, Process (computing), Nanotechnology, Dry etching, Engineering physics, Scaling
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f7a2ece826e66bfdf116c6484b2c2ed5
https://doi.org/10.1109/iitc-amc.2016.7507642