المؤلفون: Meulman, Edwin

المساهمون: University/Department: Universitat de Girona. Departament d'Enginyeria Mecànica i de la Construcció Industrial, University/Department: Universitat de Girona. Departament de Física

مرشدي الرسالة: Renart Canalias, Jordi, Carreras Blasco, Laura, Zurbitu González, Javier, Costa i Balanzat, Josep

المصدر: TDX (Tesis Doctorals en Xarxa)

مصطلحات موضوعية: Unió adhesiva, Unión adhesiva, Bonded joint, Creixement d’esquerdes per fluència, Crecimiento de grietas por fluencia, Creep crack growth, RWDC, Roller wedge driven creep, FEM, Finite element method, Superfície de fractura, Superficie de fractura, Fracture surface, Taxa d'alliberament d'energia constant, Tasa de liberación de energía constante, Constant energy release rate, Wedge driven test

وصف الملف: application/pdf

URL الوصول: http://hdl.handle.net/10803/689639

المؤلفون: Chen, Wei, He, Xu, Xu, Xiaowei, Liu, Lu

المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Wang, S.

المصدر: IEEE Transactions on Automation Science and Engineering IEEE Trans. Automat. Sci. Eng. Automation Science and Engineering, IEEE Transactions on. 21(3):4573-4584 Jul, 2024

المؤلفون: Ren, Jing, Lan, Jiani, Huang, Feifei, Huang, Mingliang

المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Zhang, Xiaowen, Lin, Xiaoling, Wei, Long

المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Fang, Tianyang, Saniie, Jafar, Bakhtiari, Sasan, Heifetz, Alexander

المصدر: 2024 IEEE International Conference on Electro Information Technology (eIT) Electro Information Technology (eIT), 2024 IEEE International Conference on. :552-555 May, 2024

Relation: 2024 IEEE International Conference on Electro Information Technology (eIT)

المؤلفون: Li, Shidong, Taylor, Christine, Arvin, Charles

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :486-490 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Al Ahsan, Mohammad, Hasan, S M Kamrul, Chakraborty, Souvik, Suhling, Jeffrey C., Lall, Pradeep

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1460-1467 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Kim, You-Gwon, Kim, Heon-Su, Kim, Tae-Wan, Ryu, Seoung-Ung, Kim, Hak-Sung, Jang, Yong-Rae, Han, Bongtae, Lee, Jun-Hyeong, Kim, Jin-Kyu

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2261-2266 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Yang, Junbo, Pan, Ke, Yin, Pengcheng, Lai, Yangyang, Park, Seungbae, Okoro, Chukwudi, Joshi, Dhananjay, Pollard, Scott

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1820-1825 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)