المؤلفون: Chen, S., Qi, W., Liu, M., Liu, X., He, K., Zhao, L., Shen, B., Lin, J., Bian, X.

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 31(2):633-641 Apr, 2024

المؤلفون: Niu, Chengchao, Song, Zhuofei^{Aff1, IDs11664024110099_cor2}

المصدر: Journal of Electronic Materials. 53(6):3035-3048

المؤلفون: Alghanmi, Ashraf, Thomas, Selvin P., Gopanna, Aravinthan, Alrefae, Majed A.

المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :148-153 Jul, 2020

Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Nesterov, N. S.^{Aff1, ID2604_cor1}, Pakharukova, V. P., Filippov, A. A., Martyanov, O. N.

المصدر: Journal of Structural Chemistry. 64(6):1114-1125

المؤلفون: Haejin Lee, Minhyung Cho, Minho Choi, Yeonghwan Song, Seung-Min Yang, Hyung Giun Kim, Kwangchoon Lee, Byoungsoo Lee

المصدر: Journal of Materials Research and Technology, Vol 25, Iss , Pp 2433-2445 (2023)

مصطلحات موضوعية: Fe–Cu alloys, Electron-beam powder bed fusion, Cu particles, Lack-of-fusion, Micro-crack, Residual stress, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423013923; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/4707496eb00947c9931a70d97025ea98

المؤلفون: Liyang Zhao, Qiuming Wang, Genhao Shi, Bing Hu, Shibiao Wang, Mingliang Qiao, Qingfeng Wang, Riping Liu

المصدر: Journal of Materials Research and Technology, Vol 23, Iss , Pp 2504-2526 (2023)

مصطلحات موضوعية: Weathering steel, Tempering, M/A constituent, Carbides, ε-Cu particles, Mechanical properties, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423001370; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/370106d52df34f63add8cb10976f0864

المؤلفون: Xiangdong Liu, Siliang He, Nishikawa, Hiroshi

المصدر: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :306-309 Apr, 2016

Relation: 2016 International Conference on Electronics Packaging (ICEP)

المؤلفون: Zhang, Y., Zhu, P., Li, G., Zhang, B., Sun, R., Wong, C.

المصدر: 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :279-282 Aug, 2015

Relation: 2015 16th International Conference on Electronic Packaging Technology (ICEPT)

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.