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1مؤتمر
المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :1-6 Sep, 2022
Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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2دورية أكاديمية
المؤلفون: Manoj Kumar Pal, Gréta Gergely, Zoltán Gácsi
المصدر: Journal of Materials Research and Technology, Vol 24, Iss , Pp 8320-8331 (2023)
مصطلحات موضوعية: Lead-free solder, Intermetallic compounds (IMCs) growth, Cu6Sn5, Cu3Sn, Diffusion kinetics, Activation energy, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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3دورية أكاديمية
المؤلفون: Md. Maruf Billah, Abdur Rahman Aad, Shimanta Das, Mohammad Motalab, Ratul Paul
المصدر: Alexandria Engineering Journal, Vol 66, Iss , Pp 79-96 (2023)
مصطلحات موضوعية: Intermetallic Compounds, SAC Solder, Anisotropic Cu3Sn, Mechanical Properties, CTE, Engineering (General). Civil engineering (General), TA1-2040
وصف الملف: electronic resource
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4دورية أكاديميةEffect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint
المؤلفون: Yang, Gangli, Li, Xiaoyan, Han, Xu, Li, Shanshan
المصدر: Soldering & Surface Mount Technology, 2022, Vol. 35, Issue 1, pp. 44-50.
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5مؤتمر
المؤلفون: Meyer, Jorg, Panchenko, Iuliana, Wambera, Laura, Bickel, Steffen, Wahrmund, Wieland, Wolf, M. Juergen
المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :405-410 May, 2017
Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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6دورية أكاديمية
المؤلفون: Kong, Minsik, Park, Sang-EonAff2, Aff3, Kim, Hye Jung, Song, Sehwan, Ryu, Dong-ChoonAff4, Aff5, Kang, Baekjune, Sohn, Changhee, Kim, Hyun Jung, Kim, Youngwook, Yoon, Sangmoon, Go, Ara, Jeen, Hyoungjeen, Park, Sungkyun, Jeong, Se-YoungAff10, Aff11, Kang, Chang-JongAff4, IDs40042022005896_cor15, Ok, Jong MokAff1, IDs40042022005896_cor16
المصدر: Journal of the Korean Physical Society. 81(7):658-663
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7دورية أكاديمية
المؤلفون: ZHU Yangyang, LI Xiaoyan, ZHANG Weidong, ZHANG Hu, HE Xi
المصدر: Cailiao gongcheng, Vol 50, Iss 9, Pp 169-176 (2022)
مصطلحات موضوعية: full cu3sn solder joint, high-temperature aging, transient liquid phase diffusion welding, microstructure, shear strength, Materials of engineering and construction. Mechanics of materials, TA401-492
وصف الملف: electronic resource
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8مؤتمر
المؤلفون: Wang, Yaodong, Chu, David T., Tu, King-Ning
المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :439-446 May, 2016
Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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9دورية أكاديمية
المؤلفون: Md. Maruf Billah, R.I. Siddiquee, Mohammad Motalab, R. Paul, M.S. Rabbi
المصدر: Journal of Materials Research and Technology, Vol 18, Iss , Pp 3044-3055 (2022)
مصطلحات موضوعية: Intermetallic compounds, Mechanical properties, SAC Solder, Ag3Sn, Cu3Sn and Cu6Sn5, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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10دورية أكاديمية
المؤلفون: Mehreen, Syeda U.Aff1, Aff2, IDs11664020087093_cor1, Nogita, KazuhiroAff1, Aff2, McDonald, Stuart D.Aff1, Aff2, Yasuda, Hideyuki, StJohn, David H.
المصدر: Journal of Electronic Materials. 50(3):881-892