المؤلفون: Wenzel, Laura, Mueller, Maik, Panchenko, Iuliana, Steller, Wolfram, Wolf, M. Juergen

المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :1-6 Sep, 2022

Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

المؤلفون: Manoj Kumar Pal, Gréta Gergely, Zoltán Gácsi

المصدر: Journal of Materials Research and Technology, Vol 24, Iss , Pp 8320-8331 (2023)

مصطلحات موضوعية: Lead-free solder, Intermetallic compounds (IMCs) growth, Cu6Sn5, Cu3Sn, Diffusion kinetics, Activation energy, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423010608; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/932dd27b59e644f3b515683a43563e18

المؤلفون: Md. Maruf Billah, Abdur Rahman Aad, Shimanta Das, Mohammad Motalab, Ratul Paul

المصدر: Alexandria Engineering Journal, Vol 66, Iss , Pp 79-96 (2023)

مصطلحات موضوعية: Intermetallic Compounds, SAC Solder, Anisotropic Cu3Sn, Mechanical Properties, CTE, Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S1110016822007578; https://doaj.org/toc/1110-0168

URL الوصول: https://doaj.org/article/ae422c0521bd4af3a1ef2f90624433bf

المؤلفون: Yang, Gangli, Li, Xiaoyan, Han, Xu, Li, Shanshan

المصدر: Soldering & Surface Mount Technology, 2022, Vol. 35, Issue 1, pp. 44-50.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SSMT-04-2022-0034

المؤلفون: Meyer, Jorg, Panchenko, Iuliana, Wambera, Laura, Bickel, Steffen, Wahrmund, Wieland, Wolf, M. Juergen

المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :405-410 May, 2017

Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

المؤلفون: Kong, Minsik, Park, Sang-Eon^{Aff2, Aff3}, Kim, Hye Jung, Song, Sehwan, Ryu, Dong-Choon^{Aff4, Aff5}, Kang, Baekjune, Sohn, Changhee, Kim, Hyun Jung, Kim, Youngwook, Yoon, Sangmoon, Go, Ara, Jeen, Hyoungjeen, Park, Sungkyun, Jeong, Se-Young^{Aff10, Aff11}, Kang, Chang-Jong^{Aff4, IDs40042022005896_cor15}, Ok, Jong Mok^{Aff1, IDs40042022005896_cor16}

المصدر: Journal of the Korean Physical Society. 81(7):658-663

المؤلفون: ZHU Yangyang, LI Xiaoyan, ZHANG Weidong, ZHANG Hu, HE Xi

المصدر: Cailiao gongcheng, Vol 50, Iss 9, Pp 169-176 (2022)

مصطلحات موضوعية: full cu3sn solder joint, high-temperature aging, transient liquid phase diffusion welding, microstructure, shear strength, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2021.000977; https://doaj.org/toc/1001-4381

URL الوصول: https://doaj.org/article/edf4d4612f6b405eb6ae4881e7532ea3

المؤلفون: Wang, Yaodong, Chu, David T., Tu, King-Ning

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :439-446 May, 2016

Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

المؤلفون: Md. Maruf Billah, R.I. Siddiquee, Mohammad Motalab, R. Paul, M.S. Rabbi

المصدر: Journal of Materials Research and Technology, Vol 18, Iss , Pp 3044-3055 (2022)

مصطلحات موضوعية: Intermetallic compounds, Mechanical properties, SAC Solder, Ag3Sn, Cu3Sn and Cu6Sn5, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785422004483; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/72227eea2d4b4f37ab56d4621e88aa46

المؤلفون: Mehreen, Syeda U.^{Aff1, Aff2, IDs11664020087093_cor1}, Nogita, Kazuhiro^{Aff1, Aff2}, McDonald, Stuart D.^{Aff1, Aff2}, Yasuda, Hideyuki, StJohn, David H.

المصدر: Journal of Electronic Materials. 50(3):881-892