المؤلفون: Chen, Xiaojun^{Aff1, IDs12221023004575_cor1}, Mo, Deyun, Cui, Zaifu, Li, Xin, Lian, Haishan

المصدر: Fibers and Polymers. 25(2):501-513

المؤلفون: Li, Nanbo, Cui, Zaifu, Lu, Han, Chen, Xuanyou, Wei, Junyan, Cai, Miao, Zhang, Ping, Yang, Daoguo

المصدر: 2016 17th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2016 17th International Conference on. :1301-1306 Aug, 2016

Relation: 2016 17th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Li, Xin, Cui, ZaiFu, Sun, Daoheng, Chen, Qinnan, He, Gonghan, Liu, Baolin, Hai, Zhenyin, Chen, Guochun, Jia, Zhiyuan, Yao, Zong

المصدر: Sensor Review, 2022, Vol. 42, Issue 4, pp. 428-439.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SR-10-2021-0384

المؤلفون: Cui, Zaifu, Chen, Xiaojun, Li, Xin, Sui, Guangzhou

المصدر: In Sensors and Actuators: A. Physical 1 February 2023 350

المؤلفون: Cui, Zaifu, Li, Xin, Chen, Guochun, Wu, Chao, He, Gonghan, Hai, Zhenyin, Chen, Qinnan, Sun, Daoheng

المصدر: In Journal of the European Ceramic Society June 2022 42(6):2735-2742

المؤلفون: Wu, Chao, Pan, Xiaochuan, Lin, Fan, Cui, Zaifu, Li, Xin, Chen, Guochun, Liu, Xianlong, He, Yingping, He, Gonghan, Hai, Zhenyin, Chen, Qinnan, Sun, Daoheng

المصدر: In Ceramics International 1 June 2022 48(11):15293-15302

المؤلفون: Cui, Zaifu, Li, Xin, Pan, Xiaochuan, Chen, Guochun, Li, Yali, Lin, Ji’an, Wu, Chao, Liu, Xianlong, Yang, Tao, Hai, Zhenyin, He, Gonghan, Chen, Qinnan, Sun, Daoheng

المصدر: In Sensors and Actuators: A. Physical 1 December 2021 332 Part 1

المؤلفون: Cai, Miao, Yang, Daoguo, Tao, Yuan, Su, Cassie, Wu, Boyi, Cui, Zaifu

المصدر: 2011 International Symposium on Advanced Packaging Materials (APM) Advanced Packaging Materials (APM), 2011 International Symposium on. :262-266 Oct, 2011

Relation: 2011 International Symposium on Advanced Packaging Materials (APM)

المؤلفون: Yang, Daoguo, Cui, Zaifu

المصدر: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. :1-4 Aug, 2011

Relation: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

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