المؤلفون: Wang, Wei-Ming, Yeh, C.W., Chia, Han-Jong, Tsui, R.F., Cui, Ji James, Tung, Chih-Hang, Yee, Kuo-Chung, Yu, Douglas C.H.

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :765-770 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Xiangyu Liu, Yumei Han, Shi Zhou, Junsheng Tian, Xuemei Qin, Cui Ji, Weidi Zhao, Anping Chen

المصدر: Scientific Reports, Vol 12, Iss 1, Pp 1-11 (2022)

مصطلحات موضوعية: Medicine, Science

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2045-2322

URL الوصول: https://doaj.org/article/b97ab2fe61d5486291ba53f5f447c75a

المؤلفون: Chia, Han-Jong, Tai, Shih-Peng, Cui, Ji James, Wang, Chuei-Tang, Tung, Chih-Hang, Yee, Kuo-Chung, Yu, Douglas C.H.

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1-4 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Kuo, Gordon, Chen, Chih-Yuan, Hsieh, Cheng-Chieh, Lee, Chung-Ju, Wu, Jason, Cui, Ji James, Kuo, Yen-Liang, Tung, Chih-Hang, Ku, Terry, Tsai, Chung-Hao, Yee, Kuo-Chung, Yu, Douglas C.H.

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1973-1976 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Liu, En-Guo, Shao, Yu-Fei, Dou, Bo, Cui, Ji-Feng, Ding, Hu^{Aff1, Aff3, IDs42417024012845_cor5}

المصدر: Journal of Vibration Engineering & Technologies. 12(4):6809-6819

المؤلفون: Liang, S. W., Wu, Gene C. Y., Yee, K. C., Wang, C. T., Cui, Ji James, Yu, Douglas C. H.

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1090-1094 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Ye, Jun-yan, Qin, Xiao-jing, Cui, Ji-fang, Ren, Qian, Jia, Lu-xia, Wang, Ya (ORCID 0000-0001-5764-6740), Pantelis, Christos, Chan, Raymond C. K.

المصدر: Journal of Autism and Developmental Disorders. Apr 2023 53(4):1509-1528.

Peer Reviewed: Y

Page Count: 20

Descriptors: Meta Analysis, Cognitive Processes, Time Perspective, Cognitive Ability, Intellectual Disability

المؤلفون: Zhang, Donglin^{Aff1, IDs41598023493875_cor1}, Cui, Ji, Zhu, Rupeng, Li, Miaomiao

المصدر: Scientific Reports. 13(1)

المؤلفون: Wang, Jue, Jing, Congcong, Hu, Xiaojuan, Cui, Ji, Tang, Qingfeng, Tu, Liping, Zhao, Shiju, Huang, Jinlian, Guo, Dandan, Li, Yongzhi^{Aff1, Aff5, IDs41598023469320_cor10}, Xu, Jiatuo^{Aff1, IDs41598023469320_cor11}

المصدر: Scientific Reports. 13(1)

المؤلفون: Liu, Jia-li, Chen, Tao, Cui, Ji-fang, Lai, Wen-hao, Zhang, Qin, Ye, Jun-yan, Yang, Tian-xiao, Wang, Ya, Chan, Raymond C.K.

المصدر: In Asian Journal of Psychiatry July 2024 97