المؤلفون: Yuksel, A., Yu, E.T., Cullinan, M., Murthy, J.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(8):1388-1393 Aug, 2020

المؤلفون: Edelstein, D., Rathore, H., Davis, C., Clevenger, L., Cowley, A., Nogami, T., Agarwala, B., Arai, S., Carbone, A., Chanda, K., Chen, F., Cohen, S., Cote, W., Cullinan, M., Dalton, T., Das, S., Davis, P., Demarest, J., Dunn, D., Dziobkowski, C., Filippi, R., Fitzsimmons, J., Flaitz, P., Gates, S., Gill, J., Grill, A., Hawken, D., Ida, K., Klaus, D., Klymko, N., Lane, M., Lane, S., Lee, J., Landers, W., Li, W.-K., Lin, Y.-H., Liniger, E., Liu, X.-H., Madan, A., Malhotra, S., Martin, J., Molis, S., Muzzy, C., Nguyen, D., Nguyen, S., Ono, M., Parks, C., Questad, D., Restaino, D., Sakamoto, A., Shaw, T., Shimooka, Y., Simon, A., Simonyi, E., Swift, A., Van Kleeck, T., Vogt, S., Wang, Y.-Y., Wille, W., Wright, J., Yang, C.-C., Yoon, M., Ivers, T.

المصدر: 2004 IEEE International Reliability Physics Symposium. Proceedings Reliability physics Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International. :316-319 2004

Relation: 2004 IEEE International Reliability Physics Symposium. Proceedings

المؤلفون: Landers, W., Edelstein, D., Clevenger, L., Das, C., Yang, C.-C., Aoki, T., Beaulieu, F., Casey, J., Cowley, A., Cullinan, M., Daubenspeck, T., Davis, C., Demarest, J., Duchesne, E., Guerin, L., Hawken, D., Ivers, T., Lane, M., Liu, X., Lombardi, T., McCarthy, C., Muzzy, C., Nadeau-Filteau, J., Questad, D., Sauter, W., Shaw, T., Wright, J.

المصدر: Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Interconnect technology Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International. :108-110 2004

Relation: Proceedings of the IEEE 2004 International Interconnect Technology Conference

المؤلفون: Edelstein, D., Davis, C., Clevenger, L., Yoon, M., Cowley, A., Nogami, T., Rathore, H., Agarwala, B., Arai, S., Carbone, A., Chanda, K., Cohen, S., Cote, W., Cullinan, M., Dalton, T., Das, S., Davis, P., Demarest, J., Dunn, D., Dziobkowski, C., Filippi, R., Fitzsimmons, J., Flaitz, P., Gates, S., Gill, J., Grill, A., Hawken, D., Ida, K., Klaus, D., Klymko, N., Lane, M., Lane, S., Lee, J., Landers, W., Li, W.-K., Lin, Y.-H., Liniger, E., Liu, X.-H., Madan, A., Malhotra, S., Martin, J., Molis, S., Muzzy, C., Nguyen, D., Nguyen, S., Ono, M., Parks, C., Questad, D., Restaino, D., Sakamoto, A., Shaw, T., Shimooka, Y., Simon, A., Simonyi, E., Tempest, S., Van Kleeck, T., Vogt, S., Wang, Y.-Y., Wille, W., Wright, J., Yang, C.-C., Ivers, T.

المصدر: Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Interconnect technology Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International. :214-216 2004

Relation: Proceedings of the IEEE 2004 International Interconnect Technology Conference

المؤلفون: Cullinan, M. P.

مصطلحات موضوعية: Computer Science - Numerical Analysis

URL الوصول: http://arxiv.org/abs/1007.4518

المؤلفون: Roy, N. K., Dibua, O. G., Cullinan, M. A.^Aff1

المصدر: JOM: The Journal of The Minerals, Metals & Materials Society (TMS). 70(3):401-406

المؤلفون: b. Hasmun, N. N., Drummond, B. K., Milne, T., Cullinan, M. P., Meldrum, A. M., Coates, D.

المصدر: European Archives of Paediatric Dentistry. :1-6

المؤلفون: Zafar, S., Coates, D. E., Cullinan, M. P., Drummond, B. K., Milne, T., Seymour, G. J.

المصدر: Clinical Oral Investigations. November 2016 20(8):2023-2035

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المؤلفون: Eusner, T., Cullinan, M., Ruggiero, C., Zarrouati, N., Chepko, A.

المصدر: In Measurement 2011 44(5):965-975