المؤلفون: Mukhopadhyay, Partha, Wenzel, Laura, Rudolph, Catharina, Tuchman, Andrew, Ryan, Kevin, Gildea, Adam, Nichols, Chris, Allgair, John, Arkalgud, Sitaram, deVilliers, Anton, Fulford, Jim

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1923-1928 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Zheng, Zihan, Chen, Yongzhen, Ding, Jie, Wang, Cuixia, Wu, Jiangfeng

المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :501-504 May, 2024

Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

المؤلفون: Ranjbar, Vida, Beerten, Robbert, Moonen, Marc, Pollin, Sofie

المصدر: 2023 IEEE Globecom Workshops (GC Wkshps) Globecom Workshops (GC Wkshps), 2023 IEEE. :20-25 Dec, 2023

Relation: 2023 IEEE Globecom Workshops (GC Wkshps)

المؤلفون: Barbera, Salvatore, Sarnataro, Chiara, Mabrouki, Sabah, Patrucco, Sara Glorio, Kaihara, Hatsumi, Tassone, Sonia

المصدر: 2023 IEEE International Workshop on Metrology for Agriculture and Forestry (MetroAgriFor) Metrology for Agriculture and Forestry (MetroAgriFor), 2023 IEEE International Workshop on. :466-471 Nov, 2023

Relation: 2023 IEEE International Workshop on Metrology for Agriculture and Forestry (MetroAgriFor)

المؤلفون: Chang, Y., Xiong, X., Xu, Q., Jin, G., Zhang, G., Cui, R.

المصدر: IEEE Geoscience and Remote Sensing Letters IEEE Geosci. Remote Sensing Lett. Geoscience and Remote Sensing Letters, IEEE. 21:1-5 2024

المؤلفون: Xu, Xinhao, Chen, Yongzhen, Wu, Jiangfeng

المصدر: 2023 IEEE 15th International Conference on ASIC (ASICON) ASIC (ASICON), 2023 IEEE 15th International Conference on. :1-4 Oct, 2023

Relation: 2023 IEEE 15th International Conference on ASIC (ASICON)

المؤلفون: Carry, Patrick, Vanderlinden, Lauren, Johnson, Randi, Buckner, Teresa, Steck, Andrea, Kechris, Katerina, Yang, Ivana, Fingerlin, Tasha, Fiehn, Oliver, Rewers, Marian, Norris, Jill

مصطلحات موضوعية: DAISY, DNA methylation, islet autoimmunity, reversion, type 1 diabetes (T1D), Humans, Diabetes Mellitus, Type 1, Female, Male, Autoimmunity, Islets of Langerhans, Disease Progression, Autoantibodies, DNA Methylation, Child, Adolescent, Longitudinal Studies, Child, Preschool, Genome-Wide Association Study, Epigenesis, Genetic

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/0g0744m1
https://escholarship.org/content/qt0g0744m1/qt0g0744m1.pdf

المؤلفون: Glorio Patrucco, S., Fortina, R., Dela Pierre, F., Dinuccio, E., Tassone, S.

المصدر: 2022 IEEE Workshop on Metrology for Agriculture and Forestry (MetroAgriFor) Metrology for Agriculture and Forestry (MetroAgriFor), 2022 IEEE Workshop on. :318-322 Nov, 2022

Relation: 2022 IEEE International Workshop on Metrology for Agriculture and Forestry (MetroAgriFor)

المؤلفون: Park, Sujin, Kim, Yi-Gyeong, Jeon, Young-Deuk, Cho, Min-Hyung, Han, Jinho, Kwon, Youngsu

المصدر: 2023 International Conference on Electronics, Information, and Communication (ICEIC) Electronics, Information, and Communication (ICEIC), 2023 International Conference on. :1-3 Feb, 2023

Relation: 2023 International Conference on Electronics, Information, and Communication (ICEIC)

المؤلفون: Wojciechowski, Andrzej A., Marcinek, Krzysztof, Pleskacz, Witold A.

المصدر: 2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) Mixed Design of Integrated Circuits and System (MIXDES), 2022 29th International Conference on. :89-92 Jun, 2022

Relation: 2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)