المؤلفون: Mohan, B, Charles Pravin, J, Keerthi, M, Prajoon, P

المصدر: 2024 7th International Conference on Devices, Circuits and Systems (ICDCS) Devices, Circuits and Systems (ICDCS), 2024 7th International Conference on. :317-321 Apr, 2024

Relation: 2024 7th International Conference on Devices, Circuits and Systems (ICDCS)

المؤلفون: Babu, K. Murali Chandra, Goel, Ekta^{Aff1, IDs1166402411102z_cor2}

المصدر: Journal of Electronic Materials. 53(7):3861-3869

المؤلفون: Yoon, J., Jeong, J., Lee, S., Lee, J., Lim, J., Baek, R.

المصدر: IEEE Access Access, IEEE. 10:22032-22037 2022

المؤلفون: Hamour, K., Bouchelga, F., Boudissa, R., Kornhuber, S., Haim, K. D.

المصدر: 2020 International Symposium on Electrical Insulating Materials (ISEIM) Electrical Insulating Materials (ISEIM), 2020 International Symposium on. :478-481 Sep, 2020

Relation: 2020 International Symposium on Electrical Insulating Materials (ISEIM)

المؤلفون: BELARBI, Abdelmalik, HAMDOUNE, Abdelkader

المصدر: 2020 1st International Conference on Communications, Control Systems and Signal Processing (CCSSP) Communications, Control Systems and Signal Processing (CCSSP), 2020 1st International Conference on. :454-459 May, 2020

Relation: 2020 1st International Conference on Communications, Control Systems and Signal Processing (CCSSP)

المؤلفون: Yadav, Shivendra^{Aff1, IDs12633022018037_cor1}, Aslam, Mohammad, Garg, Vivek, Reddy, Pallerla Joseph Ritesh

المصدر: Silicon. 14(16):10901-10908

المؤلفون: Boudissa, Rabah, Belhoul, Talit, Haim, Klaus Dieter, Kornhuber, Stefan

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 24(5):2890-2900 Oct, 2017

المؤلفون: Belhoul, Talit, Boudissa, Rabah, Haim, Klaus Dieter

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 24(1):471-482 Feb, 2017

المؤلفون: Bouatia, N., Messad, S., Bouchelga, F.^{Aff1, Aff2, IDs00202021013145_cor3}, Belhoul, T., Boudissa, R., Kornhuber, S., Haim, K. D.

المصدر: Electrical Engineering: Archiv für Elektrotechnik. 104(2):497-511

المؤلفون: Jun-Sik Yoon, Jinsu Jeong, Seunghwan Lee, Junjong Lee, Sanguk Lee, Jaewan Lim, Rock-Hyun Baek

المصدر: IEEE Access, Vol 10, Pp 22032-22037 (2022)

مصطلحات موضوعية: Grain boundary, nanosheet, doping, stress, DC performance, short-channel effect, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9721036/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/376710b9e59a43abb680aeff5772f010