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1مؤتمر
المؤلفون: Da Silva, M. J., Wiesenhofer, M., Lemesch, G., Ramsauer, F., Ladstatter, W.
المصدر: 2023 INSUCON - 14th International Electrical Insulation Conference (INSUCON) Electrical Insulation Conference (INSUCON), 2023 INSUCON - 14th International. :7-12 Apr, 2023
Relation: 2023 INSUCON - 14th International Electrical Insulation Conference (INSUCON)
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2دورية أكاديمية
المؤلفون: Colmonero-Costeira, I.Aff1, Aff2, Aff3, Aff4, IDs10329023010909_cor1, Sá, R. M., Djaló, M. L., Cunha, N., Cunha, J., Minhós, T.Aff8, Aff9, Russo, I.-R. M., Bruford, M. W., Costa, S., Ferreira da Silva, M. J.Aff1, Aff2, Aff3
المصدر: Primates. 64(6):581-587
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3مؤتمر
المؤلفون: da Silva, M. J., Pereira, F., Lamas, T. E., Cordeiro, J. F., Goncalves, C. S., Aoki, T. K., Faria, E., Hildinger, T.
المصدر: 2017 IEEE Electrical Insulation Conference (EIC) Electrical Insulation Conference (EIC), 2017 IEEE. :181-184 Jun, 2017
Relation: 2017 IEEE Electrical Insulation Conference (EIC)
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4مؤتمر
المؤلفون: da Silva, M. J., Pereira, F., Lamas, T. E., Cordeiro, J. F., Goncalves, C. S., Aoki, T. K., Faria, E., Hildinger, T.
المصدر: 2016 IEEE Electrical Insulation Conference (EIC) IEEE Electrical Insulation Conference (EIC), 2016. :198-201 Jun, 2016
Relation: 2016 IEEE Electrical Insulation Conference (EIC)
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5مؤتمر
المؤلفون: Filho, J. B. Sales, Costa, C. A. M., Cunha, G. C. L., Belfort, D. R., Catunda, S. Y. C., dos Santos, E. N., da Silva, M. J.
المصدر: 2016 IEEE 7th Latin American Symposium on Circuits & Systems (LASCAS) Circuits & Systems (LASCAS), 2016 IEEE 7th Latin American Symposium on. :291-294 Feb, 2016
Relation: 2016 IEEE 7th Latin American Symposium on Circuits & Systems (LASCAS)
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6دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
7دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
8مؤتمر
المؤلفون: da Silva, M. J., Pereira, F., Lamas, T. E., Goncalves, C. S., Cordeiro, J. F., Aoki, T. K., Faria, E., Hildinger, T.
المصدر: 2015 IEEE Electrical Insulation Conference (EIC) Electrical Insulation Conference (EIC), 2015 IEEE. :479-482 Aug, 2015
Relation: 2015 IEEE Electrical Insulation Conference
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9مؤتمر
المؤلفون: Zamarreno, C. R., Arregui, F. J., Matias, I. R., Martelli, C., Baroncini, V. H. V., dos Santos, E. N., da Silva, M. J., Morales, R. E. M.
المصدر: IEEE SENSORS 2014 Proceedings SENSORS, 2014 IEEE. :1150-1152 Nov, 2014
Relation: 2014 IEEE Sensors
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10مورد إلكتروني
المؤلفون: Van Riper, M., Knafl, G. J., Knafl, K. A., do Ceu Barbieri-Figueiredo, M., Barnoy, S., Caples, M., Choi, H., Cosgrove, B., Duarte, E. D., Honda, J., Marta, Elena, Phetrasuwan, S., Alfieri, S., Angelo, M., Deoisres, W., Fleming, L., dos Santos, A. S., da Silva, M. J. R., Marta E. (ORCID:0000-0002-2119-5148)
مصطلحات الفهرس: adaptation, cross-country, Down syndrome, family, resiliency, Settore M-PSI/05 - PSICOLOGIA SOCIALE, info:eu-repo/semantics/article
URL:
https://hdl.handle.net/10807/269538
info:eu-repo/semantics/altIdentifier/pmid/37929633
info:eu-repo/semantics/altIdentifier/wos/WOS:001098774700001
volume:196
issue:1
firstpage:1
lastpage:12
numberofpages:12
issueyear:N/A
journal:AMERICAN JOURNAL OF MEDICAL GENETICS. PART C, SEMINARS IN MEDICAL GENETICS
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