المؤلفون: Zheng, Zihan, Chen, Yongzhen, Ding, Jie, Wang, Cuixia, Wu, Jiangfeng

المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :501-504 May, 2024

Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

المؤلفون: Ranjbar, Vida, Beerten, Robbert, Moonen, Marc, Pollin, Sofie

المصدر: 2023 IEEE Globecom Workshops (GC Wkshps) Globecom Workshops (GC Wkshps), 2023 IEEE. :20-25 Dec, 2023

Relation: 2023 IEEE Globecom Workshops (GC Wkshps)

المؤلفون: Xu, Xinhao, Chen, Yongzhen, Wu, Jiangfeng

المصدر: 2023 IEEE 15th International Conference on ASIC (ASICON) ASIC (ASICON), 2023 IEEE 15th International Conference on. :1-4 Oct, 2023

Relation: 2023 IEEE 15th International Conference on ASIC (ASICON)

المؤلفون: Park, Sujin, Kim, Yi-Gyeong, Jeon, Young-Deuk, Cho, Min-Hyung, Han, Jinho, Kwon, Youngsu

المصدر: 2023 International Conference on Electronics, Information, and Communication (ICEIC) Electronics, Information, and Communication (ICEIC), 2023 International Conference on. :1-3 Feb, 2023

Relation: 2023 International Conference on Electronics, Information, and Communication (ICEIC)

المؤلفون: Wojciechowski, Andrzej A., Marcinek, Krzysztof, Pleskacz, Witold A.

المصدر: 2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) Mixed Design of Integrated Circuits and System (MIXDES), 2022 29th International Conference on. :89-92 Jun, 2022

Relation: 2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)

المؤلفون: Plihon, Aurelia, Deschaseaux, Edouard, Franiatte, Remi, Dechamp, Jerome, Vaudaine, Simon, Guillaume, Jennifer, Brunet-Manquat, Catherine, Moreau, Stephane, Coudrain, Perceval

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2122-2127 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Wang, Yu-Kuang, Lu, Ming-Tsun, Huang, Jun-Rui, Chen, Ching-Sheng, Wu, Ruey-Beei

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2333-2338 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Lee, J., Lee, S., Kang, G., Kim, J., Cho, G., Kim, H.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 57(12):3825-3839 Dec, 2022

المؤلفون: Aslani-Amoli, N., ur Rehman, M., Liu, F., Swaminathan, M., Zhuang, C., Zhelev, N.Z., Seok, S., Kim, C.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(9):1432-1445 Sep, 2022

المؤلفون: Croisfelt, Victor, Abrao, Taufik, Amiri, Abolfazl, de Carvalho, Elisabeth, Popovski, Petar

المصدر: 2021 55th Asilomar Conference on Signals, Systems, and Computers Signals, Systems, and Computers, 2021 55th Asilomar Conference on. :1242-1249 Oct, 2021

Relation: 2021 55th Asilomar Conference on Signals, Systems, and Computers