المؤلفون: Yi, H., Ozturk, E., Koelink, M., Krimmling, J., Damian, A.A., Debski, W., van Zeijl, H.W., Zhang, G., Poelma, R.H.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(6):893-901 Jun, 2022

المؤلفون: Damian, A.A., Poelma, R.H., van Zeijl, H.W., Zhang, G.Q.

المصدر: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on. :1-5 Apr, 2013

Relation: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)