يعرض 1 - 10 نتائج من 18 نتيجة بحث عن '"Daniel, Ismael Cereno"', وقت الاستعلام: 1.42s تنقيح النتائج
  1. 1
    مؤتمر
    Dielectric Stack Optimization for Die-level Warpage Reduction for Chip-to-Wafer Hybrid Bonding

    المؤلفون: Rao, B.S.S. Chandra, Kumar, Mishra Dileep, Sekhar, Vasarla Nagendra, Daniel, Ismael Cereno, Tippabhotla, Sasi Kumar, Chong, Ser Choong, C, Hemanth Kumar, Rao, Vempati Srinivasa

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :62-68 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Multi-Chip Stacked Memory Module Development using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications

    المؤلفون: Sekhar, Vasarla Nagendra, Kumar, Mishra Dileep, Tippabhotla, Sasi Kumar, Rao, B. S. S. Chandra, Daniel, Ismael Cereno, Chong, Ser Choong, Rao, Vempati Srinivasa

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2024-2030 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Development of Chip to Wafer Assembly with CuSnAg Microbump on Solder on Pad Interposer using Thermocompression and Solder Reflow

    المؤلفون: Keng Yuen, Jason Au, Chong, Ser Choong, Daniel, Ismael Cereno

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :94-99 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  4. 4
    مؤتمر
    Development of 4 die stack module using Hybrid bonding approach

    المؤلفون: Chong, Ser Choong, Keng Yuen, Jason Au, Sekhar, Vasarla Nagendra, Daniel, Ismael Cereno, Rao, Vempati Srinivasa

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :788-794 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Chip-to-Wafer Hybrid Bonding for high performance 2.5D applications

    المؤلفون: Chong, Ser Choong, Daniel, Ismael Cereno, Sekhar, Vasarla Nagendra, Lim, Sharon, Srinivas, Vempati

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :19-23 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  6. 6
    Process Development of Via Formation by Laser Drilling on Insulating Resin

    المؤلفون: Daniel Ismael Cereno, Chong Ser Choong, Hsiao Hsiang-Yao

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::66273678032bb5fd80b30468d194aba7
    https://doi.org/10.1109/eptc56328.2022.10013188

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  7. 7
    Active Device Performance after Fan-out Wafer-level Packaging Process

    المؤلفون: Hongyu Li, Daniel Ismael Cereno, V. N. Sekhar, Masaya Kawano, Simon Siak Boon Lim

    المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).

    مصطلحات موضوعية: Materials science, business.industry, Process (computing), Fan-out, Hardware_PERFORMANCEANDRELIABILITY, PMOS logic, CMOS, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Wafer, Node (circuits), business, Wafer-level packaging, NMOS logic

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6e2e7eb97b6679aa4d3079ce726ae1a9
    https://doi.org/10.1109/eptc.2018.8654434

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  8. 8
    Process Development of micro-bump flip chip bonding with Non-Conductive Film

    المؤلفون: Ser Choong Chong, Hongyu Li, Daniel Ismael Cereno, Ling Xie

    المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).

    مصطلحات موضوعية: Materials science, Packaging engineering, business.industry, Process development, Capillary action, Soldering, Stacking, Composite material, business, Electrical conductor, Flip chip, Highly accelerated stress test

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9e5762d2687c643258bd88c2ae6cd270
    https://doi.org/10.1109/eptc.2018.8654388

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  9. 9
    Laser Drilling of Thru Mold Vias (TMVs) for FOWLP Application

    المؤلفون: Vempati Srinivasa Rao, Daniel Ismael Cereno, V. N. Sekhar, David Ho

    المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).

    مصطلحات موضوعية: System in package, Fabrication, Materials science, visual_art, Package on package, visual_art.visual_art_medium, Wafer, Dielectric, Laser power scaling, Epoxy, Composite material, Laser drilling

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::af6e3654c2dc733b242e18e418cf88fb
    https://doi.org/10.1109/eptc.2018.8654286

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  10. 10
    Development of chip on wafer bonding with non conductive film using gang bonder

    المؤلفون: Ser Choong Chong, V. N. Sekhar, Ling Xie, Daniel Ismael Cereno, Hongyu Li

    المصدر: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).

    مصطلحات موضوعية: Materials science, business.industry, Wafer bonding, Hardware_PERFORMANCEANDRELIABILITY, Chip, GeneralLiterature_MISCELLANEOUS, Soldering, Hardware_INTEGRATEDCIRCUITS, Solder interconnect, Optoelectronics, Wafer, Tacking, business, Electrical conductor, Flip chip

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1d08395f8a9010f064897810fd1fe78a
    https://doi.org/10.1109/eptc.2017.8277433

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