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1دورية أكاديمية
المؤلفون: Christos Skevas, Nicolás Pérez de Olaguer, Albert Lleó, David Thiwa, Ulrike Schroeter, Inês Valente Lopes, Luca Mautone, Stephan J. Linke, Martin Stephan Spitzer, Daniel Yap, Di Xiao
المصدر: BMC Ophthalmology, Vol 24, Iss 1, Pp 1-12 (2024)
مصطلحات موضوعية: Artificial intelligence, Telemedicine, AMD, Glaucoma, Diabetic retinopathy, Screening, Ophthalmology, RE1-994
وصف الملف: electronic resource
Relation: https://doaj.org/toc/1471-2415
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2
المؤلفون: Peng Zhang, Pedro A. Forero, Daniel Yap, Dusan Radosevic
المصدر: Proceedings of the WNS3 2022.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ee633abb21f6730da60df9468f79c740
https://doi.org/10.1145/3532577.3532601 -
3
المؤلفون: James H. Schaffner, Daniel Yap, Gabriel Virbila
المصدر: 2019 International Topical Meeting on Microwave Photonics (MWP).
مصطلحات موضوعية: Spread spectrum, Band-pass filter, Computer science, business.industry, Encoding (memory), Electronic engineering, Limiter, Jamming, Wideband, Photonics, business, Decoding methods
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2f92757db39c906f6a1aead7e877971d
https://doi.org/10.1109/mwp.2019.8892125 -
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المؤلفون: Gabriel Virbila, Johann Troles, Tsung L. Yang, Laurent Brilland, Daniel Yap, David L. Persechini
المصدر: 2018 International Topical Meeting on Microwave Photonics (MWP).
مصطلحات موضوعية: Optical fiber, Materials science, business.industry, 02 engineering and technology, Laser, 01 natural sciences, law.invention, 010309 optics, Brillouin zone, 020210 optoelectronics & photonics, law, Brillouin scattering, Fiber laser, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Limiter, Optoelectronics, Wideband, Photonics, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ff2e5aa94ea01ebdf42b68677794831e
https://doi.org/10.1109/mwp.2018.8552902 -
5
المؤلفون: Daniel Yap, Luc Petit, Roberto Antonicelli, Seung Wook Yoon, Kim Sing Wong
المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Engineering, business.industry, 020208 electrical & electronic engineering, 02 engineering and technology, 01 natural sciences, Automotive engineering, Embedded Wafer Level Ball Grid Array, Printed circuit board, Reliability (semiconductor), Chip-scale package, Ball grid array, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Redistribution layer, business, Wafer-level packaging, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::34b56d47766f30fc18ec68b37e0b2d06
https://doi.org/10.1109/ectc.2017.194 -
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المؤلفون: Roberto Antonicelli, Bernard Adams, Seung Wook Yoon, Lin Yaojian, Kim Sing Wong, Luc Petit, Daniel Yap
المصدر: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
مصطلحات موضوعية: 010302 applied physics, Engineering, Packaging engineering, business.industry, 020208 electrical & electronic engineering, 02 engineering and technology, 01 natural sciences, Automotive engineering, Embedded Wafer Level Ball Grid Array, Reliability (semiconductor), Ball grid array, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Redistribution layer, business, Solder mask, Wafer-level packaging, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5fdae6df569cf3d3aa47a8ce744fe3b8
https://doi.org/10.1109/eptc.2016.7861518 -
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المؤلفون: Priyalal Wijewarnasuriya, Christoph H. Grein, Rajesh D. Rajavel, D. Okerlund, T. J. de Lyon, A. C. Ionescu, E. Robinson, Hasan Sharifi, Daniel Yap, A. I. D'Souza, Nibir K. Dhar, M. Roebuck
المصدر: Journal of Electronic Materials. 41:2671-2678
مصطلحات موضوعية: Materials science, Solid-state physics, Infrared, business.industry, Detector, Spectral response, Condensed Matter Physics, Electronic, Optical and Magnetic Materials, Wavelength, Optics, Attenuation coefficient, Materials Chemistry, Cutoff, Electrical and Electronic Engineering, Atomic physics, business, Electronic band structure
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8Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages
المؤلفون: Zhaowei Zhong, Tong Yan Tee, Daniel Yap, Hun Shen Ng
المصدر: Microelectronics Reliability. 43:1329-1338
مصطلحات موضوعية: Materials science, business.industry, Temperature cycling, Structural engineering, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Die (integrated circuit), Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Soldering, Quad Flat No-leads package, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Material properties, Fillet (mechanics), Joint (geology), Test data
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9
المؤلفون: Carol Toh, Chek Lim Kho, Tong Yan Tee, Zhaowei Zhong, Daniel Yap, Xavier Baraton
المصدر: Microelectronics Reliability. 43:741-749
مصطلحات موضوعية: Materials science, Moisture, Delamination, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Die (integrated circuit), Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Stress (mechanics), Substrate (building), Ball grid array, Ultimate tensile strength, Forensic engineering, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, Flip chip
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10
المؤلفون: L.R. Hamilton, Peter Petre, Stephen D. Gedney, Daniel Yap
المصدر: International Journal of RF and Microwave Computer-Aided Engineering. 10:308-318
مصطلحات موضوعية: Engineering, Full wave, Filter (video), business.industry, Electronic engineering, CAD, Electrical and Electronic Engineering, Full wave analysis, business, Computer Graphics and Computer-Aided Design, Multiplexer, Computer Science Applications
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2ce733e788898044f8d8f880ea867c84
https://doi.org/10.1002/1099-047x(200009)10:5<308::aid-mmce6>3.0.co;2-c