المؤلفون: Dahai Liu, Qiang Fu, Leyna G. Liu, Wenwen Li, Fei Qi, Justin Liu, Lifeng Shang, Xiu Wang, Fang Yang, Jie Li, Daoqiang Lu, Huiying Feng, Ziwen Zhang, Yiqing Chen, Junru Liang, Jiayi Yao, Hua Lv, Riwang Li, Jun Wang, Di Wu, Yuxi Liu, Chenglai Xia, Wenxing Li

المصدر: Frontiers in Cell and Developmental Biology, Vol 12 (2024)

مصطلحات موضوعية: rheumatoid arthritis, traditional Chinese medicine, Juan-Bi decoction, systems pharmacology, bornyl acetate, Biology (General), QH301-705.5

وصف الملف: electronic resource

Relation: https://www.frontiersin.org/articles/10.3389/fcell.2024.1396890/full; https://doaj.org/toc/2296-634X

URL الوصول: https://doaj.org/article/34096517501747a2bb5531174933600c

المؤلفون: Nabila Begum, Qudrat Ullah Khan, Sam Al-Dalali, Daoqiang Lu, Fang Yang, Jie Li, Di Wu, Riwang Li, Jun Wang, Dahai Liu, Huanlu Song

المصدر: Frontiers in Sustainable Food Systems, Vol 7 (2024)

مصطلحات موضوعية: cultured meat, enzymatic hydrolysate, ultrafiltration, antioxidant capacity, chromatography, hydrophobicity, Nutrition. Foods and food supply, TX341-641, Food processing and manufacture, TP368-456

وصف الملف: electronic resource

Relation: https://www.frontiersin.org/articles/10.3389/fsufs.2023.1345833/full; https://doaj.org/toc/2571-581X

URL الوصول: https://doaj.org/article/c04368e4a75e4793ae3cc61e17047b2f

المؤلفون: Daoqiang Lu, Wong, C.P.

المصدر: 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Adhesive joining and coating technology in electronics manufacturing Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on. :110-116 2000

Relation: 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000

المؤلفون: Wong, C.P., Daoqiang Lu

المصدر: 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Adhesive joining and coating technology in electronics manufacturing Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on. :121-128 2000

Relation: 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000

المؤلفون: Daoqiang Lu, Wong, C.P.

المصدر: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on. :24-31 2000

Relation: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

المؤلفون: Daoqiang Lu, Wong, C.P.

المصدر: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on. :7-13 2000

Relation: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

المؤلفون: Daoqiang Lu, Wong, D., Wong, C.P.

المصدر: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on. :311-318 2000

Relation: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

المؤلفون: Shimada, Y., Daoqiang Lu, Wong, C.P.

المصدر: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on. :336-342 2000

Relation: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

المؤلفون: Daoqiang Lu, Wong, C.P., Tong, Q.K., Zhang, E.

المصدر: 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Electronic components and technology Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th. :892-898 2000

Relation: 2000 Proceedings. 50th Electronic Components and Technology Conference

المؤلفون: Daoqiang Lu, Wong, C.P., Tong, Q.K.

المصدر: 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) Electronic components and technology Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th. :342-346 1999

Relation: 1999 Proceedings. 49th Electronic Components and Technology Conference