المؤلفون: Chengqian Wang, Keyu Luo, Peng He, Hongzhi Zhou, Rongqing Li, Zhihao Zhang, Daquan Yu, Shuye Zhang

المصدر: Journal of Materials Research and Technology, Vol 24, Iss , Pp 1875-1881 (2023)

مصطلحات موضوعية: SnAg solder, Shear strength, EBSD, IMC, Thermal ageing, Ni electroplating, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423005653; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/999416b85cb246d0a3c1d3a53ff05bcd

المؤلفون: Chen Yu, Shaocheng Wu, Yi Zhong, Rongbin Xu, Tian Yu, Jin Zhao, Daquan Yu

المصدر: Sensors, Vol 24, Iss 1, p 171 (2023)

مصطلحات موضوعية: Through Glass Via, MEMS sensors, sensor manufacturing, sensor packaging, Chemical technology, TP1-1185

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1424-8220/24/1/171; https://doaj.org/toc/1424-8220

URL الوصول: https://doaj.org/article/d5d8ee024cc0416e82b2938766c42c1d

المؤلفون: Jin Zhao, Zuohuan Chen, Fei Qin, Daquan Yu

المصدر: Micromachines, Vol 13, Iss 10, p 1799 (2022)

مصطلحات موضوعية: thermo-mechanical reliability, through glass vias, finite-element method, 3D vertical interconnection, crack, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/13/10/1799; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/1d8a9eb498134b19b9984cab262a8bbf

المؤلفون: Zuohuan Chen, Daquan Yu

المصدر: Sensors, Vol 22, Iss 15, p 5760 (2022)

مصطلحات موضوعية: surface acoustic wave filter, wafer-level packaging, laser drilling, finite element model, reliability, Chemical technology, TP1-1185

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1424-8220/22/15/5760; https://doaj.org/toc/1424-8220

URL الوصول: https://doaj.org/article/02f5f5d3a8d94c07814eadfb5918eab6

المؤلفون: Zuohuan Chen, Daquan Yu, Yi Zhong

المصدر: Sensors, Vol 22, Iss 6, p 2114 (2022)

مصطلحات موضوعية: RF filter, wafer-level TSV/TGV capping packaging, transient liquid phase bonding, Chemical technology, TP1-1185

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1424-8220/22/6/2114; https://doaj.org/toc/1424-8220

URL الوصول: https://doaj.org/article/181a3aa065fc4f6bb007dc0739e90400

المؤلفون: Tianshen Zhou, Shuying Ma, Daquan Yu, Ming Li, Tao Hang

المصدر: Sensors, Vol 20, Iss 15, p 4077 (2020)

مصطلحات موضوعية: CMOS image sensor, automotive, WLCSP, TSV, AEC-Q100, Chemical technology, TP1-1185

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1424-8220/20/15/4077; https://doaj.org/toc/1424-8220

URL الوصول: https://doaj.org/article/0304a86a10a74db88de3e0000b41ea49

المؤلفون: Xiaoli, Ren, Junying, Wei, Daquan, Yu

المصدر: 2020 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA) Integrated Circuits, Technologies and Applications (ICTA), 2020 IEEE International Conference on. :127-129 Nov, 2020

Relation: 2020 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)

المؤلفون: Mengke, YANG, Fei, QIN, Daquan, YU

المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :886-890 Aug, 2018

Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Xie, Huiqin, Li, Jun, Song, Jian, Hou, Fengze, Guo, Xueping, Wang, Shuling, Daquan, Yu, Liqiang, Cao, Wan, Lixi

المصدر: 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :64-67 Aug, 2013

Relation: 2013 14th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Si, Chen, Fei, Qin, Guofeng, Xia, Wei, Wu, Daquan, Yu, Yuan, Lu

المصدر: 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :234-237 Aug, 2013

Relation: 2013 14th International Conference on Electronic Packaging Technology (ICEPT)