المؤلفون: Roshen, W.A., Korman, C.S., Daum, W.

المصدر: 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551) Power electronics specialists conference Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual. 3:2467-2473 Vol.3 2004

Relation: 2004 IEEE 35th Annual Power Electronics Specialists Conference

المؤلفون: Roshen, W.A., Korman, C.S., Daum, W.

المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 21(4):867-879 Jul, 2006

المؤلفون: Burdick, W., Daum, W.

المصدر: Proceedings., International Test Conference International test conference 1994 Test Conference, 1994. Proceedings., International. :30-40 1994

Relation: Proceedings of International Test Conference

المؤلفون: Fillion, R.A., Wojnarowski, R.J., Bicknell, W.H., Daum, W., Forman, G.

المصدر: Proceedings of the International Conference on Multichip Modules Multichip Modules, 1994. Proceedings of the 1994 International Conference on. :464-473 1994

Relation: Proceedings of the International Conference on Multichip Modules

المؤلفون: Stallberg, K.^{Aff1, Aff2}, Lilienkamp, G., Daum, W.

المصدر: Plasmonics. 14(6):1489-1496

المؤلفون: Roszel, L.E., Daum, W.

المصدر: Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE. :36-39 1992

Relation: 1992 IEEE Multi-Chip Module Conference

المؤلفون: Fillion, R.A., Wojnarowski, R.J., Daum, W.

المصدر: 40th Conference Proceedings on Electronic Components and Technology Electronic Components and Technology Conference, 1990. ., 40th. :554-558 vol.1 1990

Relation: 40th Conference Proceedings on Electronic Components and Technology

المؤلفون: Adler, M.S., Wildi, E.J., Daum, W., Becker, C.A.

المصدر: 1993 IEEE International Solid-State Circuits Conference Digest of Technical Papers Solid-State Circuits Conference, 1993. Digest of Technical Papers. 40th ISSCC., 1993 IEEE International. :170-171 1993

Relation: Proceedings of IEEE International Solid-State Circuits Conference - ISSCC '93

المؤلفون: Daum, W., Burdick, W.E., Jr.

المصدر: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B IEEE Trans. Comp., Packag., Manufact. Technol. B Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on. 17(3):277-282 Aug, 1994

المؤلفون: Daum, W., Burdick, W.E., Jr., Fillion, R.A.

المصدر: Computer. 26(4):23-29 Apr, 1993