نتائج البحث - "David Huitink"

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دورية أكاديمية

Tribochemistry as an Alternative Synthesis Pathway

المؤلفون: Hayden Carlton, David Huitink, Hong Liang

المصدر: Lubricants, Vol 8, Iss 9, p 87 (2020)

مصطلحات موضوعية: tribochemistry, mechanochemistry, tribology, surface chemistry, Science

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2075-4442/8/9/87; https://doaj.org/toc/2075-4442

URL الوصول: https://doaj.org/article/e2efc6a5a6824e76ac1d7ecf7258dba2

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Synthesis of nano-size paraffin/silica-based encapsulated phase change materials of high encapsulation ratio via sol–gel method

المؤلفون: Muhammad Ghufran, David Huitink

المصدر: Journal of Materials Science. 58:7673-7689

مصطلحات موضوعية: Mechanics of Materials, Mechanical Engineering, General Materials Science

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::676226811faccc881480cd6dbf7b4f0a
https://doi.org/10.1007/s10853-023-08462-y

Find this article in full text from Springer Verlag.

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3

Electrothermal System Design and Evaluation of Low EMI and Thermally Balanced 150 kW T-Type Traction Inverter

المؤلفون: Reece Whitt, Zhao Yuan, Asif Imran Emon, Fang Luo, David Huitink

المصدر: IEEE Transactions on Power Electronics. 38:538-547

مصطلحات موضوعية: Electrical and Electronic Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bdfb47728dd8d66aaf20c4c5d3b80c32
https://doi.org/10.1109/tpel.2022.3200402

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Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module

المؤلفون: Asif Imran Emon, Hayden Carlton, John Harris, Alexis Krone, Mustafeez Ul Hassan, Abdul Basit Mirza, Maksudul Hossain, Arman Ur Rashid, Yuxiang Chen, Fang Luo, David Huitink, Alan Mantooth

المصدر: IEEE Transactions on Transportation Electrification. 8:4391-4407

مصطلحات موضوعية: Automotive Engineering, Energy Engineering and Power Technology, Transportation, Electrical and Electronic Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::df6b845837123ee639e0a6a8dc56abd7
https://doi.org/10.1109/tte.2022.3173585

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Insulation and Switching Performance Optimization for Partial-Discharge-Free Laminated Busbar in More-Electric Aircraft Applications

المؤلفون: Zhao Yuan, Yalin Wang, Zhongjing Wang, Asif Imran Emon, Mustafeez ul-Hassan, Fang Luo, David Huitink

المصدر: IEEE Transactions on Power Electronics. 37:6831-6843

مصطلحات موضوعية: 020208 electrical & electronic engineering, 0202 electrical engineering, electronic engineering, information engineering, 02 engineering and technology, Electrical and Electronic Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7453f608dcfd5b360c7a9c8d97732214
https://doi.org/10.1109/tpel.2021.3137839

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HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

المؤلفون: Ange Christian Iradukunda, David Huitink, Kevin Kayijuka, Tarek Gebrael, Nenad Miljkovic

المصدر: Journal of Electronic Packaging. 145

مصطلحات موضوعية: Mechanics of Materials, Electrical and Electronic Engineering, Computer Science Applications, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::613fa894cadbc1938b637a778f9257f6
https://doi.org/10.1115/1.4056031

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Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance

المؤلفون: Hongwu Peng, H. Alan Mantooth, Sayan Seal, Mahsa Montazeri, Andrea K. Wallace, Fang Luo, David Huitink

المصدر: IEEE Journal of Emerging and Selected Topics in Power Electronics. 9:3904-3915

مصطلحات موضوعية: Materials science, business.industry, Energy Engineering and Power Technology, High voltage, Hardware_PERFORMANCEANDRELIABILITY, Temperature cycling, Inductance, Reliability (semiconductor), MOSFET, Parasitic element, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Field-effect transistor, Electrical and Electronic Engineering, business, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cace3fdd3f99cea08e28bd0a60ec5b0d
https://doi.org/10.1109/jestpe.2020.3032886

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Melt Front Enhancement of Phase Change Materials via Nanoparticle Inclusion for Improved Heat Transfer and Cyclability

المؤلفون: Joshua Kasitz, Larry Marshall, David Huitink

المصدر: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bbf3afbc18b89771957fe3a94d49eb15
https://doi.org/10.1115/ipack2022-97399

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Dual Converging Jets for Enhanced Liquid Impingement Cooling

المؤلفون: Reece Whitt, Rafael Estrella, David Huitink

المصدر: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9a9d2b3702458460a5692122f901982a
https://doi.org/10.1115/ipack2022-96635

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Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling

المؤلفون: Zion Clarke, Sonya Smith, Reece Whitt, David Huitink

المصدر: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0377e8d2e3d4ff0439df5497acab1312
https://doi.org/10.1115/ipack2022-97446

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