المؤلفون: Ngo, A.T., Dey, B., Halder, S., De Gendt, S., Wang, C.

المصدر: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 36(1):1-13 Feb, 2023

المؤلفون: Wyndaele, P.-J.^{Aff1, Aff2, IDs4169902400464x_cor1}, de Marneffe, J.-F., Sergeant, S., de la Rosa, C. J. L., Brems, S., Caro, A. M., De Gendt, S.^{Aff1, Aff2}

المصدر: npj 2D Materials and Applications. 8(1)

المؤلفون: Dehaerne, E., Dey, B., Halder, S., De Gendt, S., Meert, W.

المصدر: IEEE Access Access, IEEE. 10:82434-82455 2022

المؤلفون: Resta, G.V., Leonhardt, A., Balaji, Y., De Gendt, S., Gaillardon, P., De Micheli, G.

المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 27(7):1486-1503 Jul, 2019

المؤلفون: Verreck, D., Arutchelvan, G., Lockhart De La Rosa, C.J., Leonhardt, A., Chiappe, D., Lu, A.K.A., Pourtois, G., Matagne, P., Heyns, M.M., De Gendt, S., Mocuta, A., Radu, I.P.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 65(10):4635-4640 Oct, 2018

المؤلفون: Hartman, V., Roeyen, E., Bracke, B., Huysentruyt, F., De Gendt, S., Chapelle, T., Ysebaert, D., Hendrikx, B., Roeyen, G.

المصدر: In Pancreatology August 2023 23(5):563-568

المؤلفون: Zhang, L., de Marneffe, J.-F., Heylen, N., Murdoch, G., Tokei, Z., Boemmels, J., De Gendt, S., Baklanov, M. R.

المصدر: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :345-348 May, 2015

Relation: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

المؤلفون: Krishtab, M., Vanstreels, K., De Gendt, S., Baklanov, M.

المصدر: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :103-106 May, 2015

Relation: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

المؤلفون: Zhang, L., de Marneffe, J.-F., Lesniewska, A., Verdonck, P., Heylen, N., Murdoch, G., Croes, K., Tokei, Zs., Bommels, J., Lefferts, S., De Gendt, S., Baklanov, M.R.

المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 IEEE International. :21-23 May, 2016

Relation: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.