المؤلفون: Hiblot, G., Parihar, N., Dupuy, E., Mannaert, G., Baudot, S., Kaczer, B., Franco, J., Vandooren, A., De Heyn, V., Mercha, A.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 21(2):192-198 Jun, 2021

المؤلفون: Vandooren, A., Witters, L., Franco, J., Mallik, A., Parvais, B., Wu, Z., Li, W., Rosseel, E., Hikkavyy, A., Peng, L., Rassoul, N., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Waldron, N., Boemmels, J., De Heyn, V., Mocuta, D., Ryckaert, J., Collaert, N.

المصدر: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2018 IEEE. :1-4 Oct, 2018

Relation: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

المؤلفون: Arimura, H., Cott, D., Boccardi, G., Loo, R., Wostyn, K., Witters, L., Conard, T., Suhard, S., van Dorp, D., Dekkers, H., Ragnarsson, L., Mitard, J., De Heyn, V., Mocuta, D., Collaert, N., Horiguchi, N.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 66(12):5387-5392 Dec, 2019

المؤلفون: Vandooren, A., Witters, L., Franco, J., Mallik, A., Parvais, B., Wu, Z., Walke, A., Deshpande, V., Rosseel, E., Hikavyy, A., Li, W., Peng, L., Rassoul, N., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Waldron, N., De Heyn, V., Mocuta, D., Collaert, N.

المصدر: 2018 International Conference on IC Design & Technology (ICICDT) IC Design & Technology (ICICDT), 2018 International Conference on. :145-148 Jun, 2018

Relation: 2018 International Conference on IC Design & Technology (ICICDT)

المؤلفون: Vandooren, A., Franco, J., Parvais, B., Wu, Z., Witters, L., Walke, A., Li, W., Peng, L., Deshpande, V., Bufler, F.M., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B.T., Ritzenthaler, R., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B., Waldron, N., De Heyn, V., Mocuta, D., Collaert, N.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 65(11):5165-5171 Nov, 2018

المؤلفون: Capogreco, E., Witters, L., Arimura, H., Sebaai, F., Porret, C., Hikavyy, A., Loo, R., Milenin, A.P., Eneman, G., Favia, P., Bender, H., Wostyn, K., Dentoni Litta, E., Schulze, A., Vrancken, C., Opdebeeck, A., Mitard, J., Langer, R., Holsteyns, F., Waldron, N., Barla, K., De Heyn, V., Mocuta, D., Collaert, N.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 65(11):5145-5150 Nov, 2018

المؤلفون: Witters, L., Arimura, H., Sebaai, F., Hikavyy, A., Milenin, A.P., Loo, R., De Keersgieter, A., Eneman, G., Schram, T., Wostyn, K., Devriendt, K., Schulze, A., Lieten, R., Bilodeau, S., Cooper, E., Storck, P., Chiu, E., Vrancken, C., Favia, P., Vancoille, E., Mitard, J., Langer, R., Opdebeeck, A., Holsteyns, F., Waldron, N., Barla, K., De Heyn, V., Mocuta, D., Collaert, N.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 64(11):4587-4593 Nov, 2017

المؤلفون: Vandooren, A., Wu, Z., Khaled, A., Franco, J., Parvais, B., Li, W., Witters, L., Walke, A., Peng, L., Rassoul, N., Matagne, P., Debruyn, H., Jamieson, G., Inoue, F., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Radisic, D., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B.-Y., Waldron, N., De Heyn, V., Demuynck, S., Boemmels, J., Ryckaert, J., Collaert, N., Mocuta, D.

المصدر: 2019 Symposium on VLSI Technology VLSI Technology, 2019 Symposium on. :T56-T57 Jun, 2019

Relation: 2019 Symposium on VLSI Technology

المؤلفون: Arimura, H., Cott, D., Boccardi, G., Loo, R., Wostyn, K., Brus, S., Capogreco, E., Opdebeeck, A., Witters, L., Conard, T., Suhard, S., Van Dorp, D., Kenis, K., Ragnarsson, L.-A., Mitard, J., Holsteyns, F., De Heyn, V., Mocuta, D., Collaert, N., Horiguchi, N.

المصدر: 2019 Symposium on VLSI Technology VLSI Technology, 2019 Symposium on. :T92-T93 Jun, 2019

Relation: 2019 Symposium on VLSI Technology

المؤلفون: Capogreco, E., Arimura, H., Witters, L., Vohra, A., Porret, C., Loo, R., De Keersgieter, A., Dupuy, E., Marinov, D., Hikavyy, A., Sebaai, F., Mannaert, G., Ragnarsson, L.-A., Siew, Y. K., Vrancken, C., Opdebeeck, A., Mitard, J., Langer, R., Sanchez, E. Altamirano, Holstetns, F., Demuynck, S., Barla, K., De Heyn, V., Mocuta, D., Collaert, N., Horiguchi, N.

المصدر: 2019 Symposium on VLSI Technology VLSI Technology, 2019 Symposium on. :T94-T95 Jun, 2019

Relation: 2019 Symposium on VLSI Technology