المؤلفون: De Messemaeker, Joke, Van Sever, Koen, Tsau, Yan Wen, Zhang, Boyao, Croes, Kristof, Beyne, Eric

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1853-1858 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Chew, Soon-Aik, Zhang, Boyao, Vanstreels, Kris, Chery, Emmanuel, De Messemaeker, Joke, Witters, Liesbeth, Van Sever, Koen, Iacovo, Serena, Dewilde, Sven, Stucchi, Michele, De Vos, Joeri, Beyer, Gerald, Miller, Andy, Beyne, Eric

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Kwak, Ji-Youn, Chery, Emmanuel, Bertheau, Julien, Slabbekoorn, John, De Messemaeker, Joke, Beyne, Eric

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1080-1084 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: De Messemaeker, Joke, Witters, Liesbeth, Zhang, Boyao, Tsau, Yan Wen, Fodor, Ferenc, De Vos, Joeri, Beyer, Gerald, Croes, Kristof, Beyne, Eric

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :109-113 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Wang, Teng, De Messemaeker, Joke, Cherman, Vladimir, Kay, Alvin Chow Chee, Cadacio, Francisco, Matterne, Mireille, Simons, Veerle, Van De Peer, Myriam, Lesniewska, Alicja, Pedreira, Olalla Varela, Gerets, Carine, Rebibis, Kenneth June, Beyne, Eric

المصدر: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-5 Dec, 2015

Relation: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

المؤلفون: Tsau, Yan Wen, De Messemaeker, Joke, Salahouelhadj, Abdellah, Gonzalez, Mario, Witters, Liesbeth, Zhang, Boyao, Seefeldt, Marc, Beyne, Eric, De Wolf, Ingrid

المصدر: In Microelectronics Reliability November 2022 138

المؤلفون: De Messemaeker, Joke, Pedreira, Olalla Varela, Philipsen, Harold, Beyne, Eric, De Wolf, Ingrid, Van der Donck, Tom, Croes, Kristof

المصدر: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :613-619 May, 2014

Relation: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

المؤلفون: Nabiollahi, Nabi, Moelans, Nele, Gonzalez, Mario, De Messemaeker, Joke, Wilson, Christopher J., Croes, Kristof, Beyne, Eric, De Wolf, Ingrid

المصدر: 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on. :1-4 Apr, 2014

Relation: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: De Messemaeker, Joke, Pedreira, Olalla Varela, Vandevelde, Bart, Philipsen, Harold, De Wolf, Ingrid, Beyne, Eric, Croes, Kristof

المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :586-591 May, 2013

Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Nabiollahi, Nabi, Wilson, Christopher J., De Messemaeker, Joke, Gonzalez, Mario, Croes, Kristof, Beyne, Eric, De Wolf, Ingrid

المصدر: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on. :1-4 Apr, 2013

Relation: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)