المؤلفون: Vega-Gonzalez, V., Montero, D., Versluijs, J., Pedreira, O. Varela, Jourdan, N., Puliyalil, H., Chehab, B., Peissker, T., Haider, A., Batuk, D., Martinez, G. T., Geypen, J., Le, Q. T., Bazzazian, N., Heylen, N., van der Veen, M., El-Mekki, Z., Webers, T., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Gillijns, W., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Kimura, Y., Ciofi, I., De Wachter, B., Swerts, J., Grieten, E., Ercken, M., Kim, R., Croes, K., Leray, P., Jaysankar, M., Nagesh, N., Ramakers, L., Murdoch, G., Park, S., Tokei, Z., Dentoni-Litta, E., Horiguchi, N.

المصدر: 2021 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2021 IEEE International. :1-3 Jul, 2021

Relation: 2021 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Gupta, A., Radisic, D., Maes, J. W., Pedreira, O. Varela, Soulie, J-P., Jourdan, N., Mertens, H., Bandyopadhyay, S., Le, Q. T., Pacco, A., Heylen, N., Vandersmissen, K., Devriendt, K., Zhu, C., Datta, S., Sebaai, F., Wang, S., Mousa, M., Lee, J., Geypen, J., De Wachter, B., Chehab, B., Salahuddin, S. M., Murdoch, G., Biesemans, S., Tokei, Zs., Litta, E. Dentoni, Horiguchi, N.

المصدر: 2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :22.5.1-22.5.4 Dec, 2021

Relation: 2021 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Vega-Gonzalez, V., Puliyalil, H., Versluijs, J., Lesniewska, A., Varela-Pereira, O., Baert, R., Paolillo, S., Decoster, S., Schleicher, F., Montero, D., Bekaert, J., Kesters, E., Le, Q. T., Lorant, C., Teugels, L., Heylen, N., Jourdan, N., El-Mekki, Z., van der Veen, M., Ciofi, I., Briggs, B., Heijlen, J., Dupas, L., De-Wachter, B., Vancoille, E., Webers, T., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Kimura, Y., Demonie, I., Lazzarino, F., Ercken, M, Kim, R., Trivkovic, D., Croes, K., Leray, P., Jaysankar, M., Wilson., C., Muroch, G., Tokei, Z.

المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :20.5.1-20.5.4 Dec, 2020

Relation: 2020 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Vega-Gonzalez, V., Wilson, C. J., Briggs, B., Decoster, S., Versluijs, J., Lesniewska, A., Paolillo, S., Baert, R., Puliyalil, H., Bekaert, J., Kesters, E., Le, Q. T., Lorant, C., Varela P., O., Teugels, L., Heylen, N., El-Mekki, Z., van der Veen, M., Webers, T., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Kimura, Y., Jourdan, N., Ciofi, I., Gupta, A., Contino, A., Boccardi, G., Lariviere, S., Dupas, L., De-Wachter, B., Vancoille, E., Lazzarino, F., Ercken, M, Debacker, P., Kim, R., Trivkovic, D., Croes, K., Leray, P., Dillemans, L., Chen, Y.-F., Tokei, Z.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :19.3.1-19.3.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Manna, A. La, Guo, W., Van Huylenbroeck, S., Sirignano, E., Cherman, V., Van der Plas, G., De Wachter, B., Phommahaxay, A., Jourdain, Anne, Beyer, G., Beyne, E.

المصدر: 2013 Eurpoean Microelectronics Packaging Conference (EMPC) Microelectronics Packaging Conference (EMPC) , 2013 European. :1-7 Sep, 2013

Relation: 2013 European Microelectronics Packaging Conference (EMPC)

المؤلفون: Guo, W., Van Der Plas, G., Ivankovic, A., Eneman, G., Cherman, V., De Wachter, B., Mercha, A., Gonzalez, M., Civale, Y., Redolfi, A., Buisson, T., Jourdan, A., Vandevelde, B., Rebibis, K.J., De Wolf, I., La Manna, A., Beyer, G., Beyne, E., Swinnen, B.

المصدر: 2012 IEEE International Conference on IC Design & Technology IC Design & Technology (ICICDT), 2012 IEEE International Conference on. :1-4 May, 2012

Relation: 2012 IEEE International Conference on IC Design & Technology (ICICDT)

المؤلفون: Collaert, N., Aoulaiche, M., De Keersgieter, A., De Wachter, B., Jurczak, M., Altimime, L.

المصدر: 2010 Proceedings of the European Solid State Device Research Conference Solid-State Device Research Conference (ESSDERC), 2010 Proceedings of the European. :154-157 Sep, 2010

Relation: ESSDERC 2010 - 40th European Solid State Device Research Conference

المؤلفون: Van der Plas, G., Limaye, P., Loi, I., Mercha, A., Oprins, H., Torregiani, C., Thijs, S., Linten, D., Stucchi, M., Katti, G., Velenis, D., Cherman, V., Vandevelde, B., Simons, V., De Wolf, I., Labie, R., Perry, D., Bronckers, S., Minas, N., Cupac, M., Ruythooren, W., Van Olmen, J., Phommahaxay, A., de Potter de ten Broeck, M., Opdebeeck, A., Rakowski, M., De Wachter, B., Dehan, M., Nelis, M., Agarwal, R., Pullini, A., Angiolini, F., Benini, L., Dehaene, W., Travaly, Y., Beyne, E., Marchal, P.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 46(1):293-307 Jan, 2011

المؤلفون: Poliakov, P., Anchlia, A., Bardon, M. G., Rooseleer, B., De Wachter, B., Collaert, N., van der Zanden, K., Dehaene, W., Verkest, D., Corbalan, M. M.

المصدر: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 57(3):183-187 Mar, 2010

المؤلفون: Collaert, N., Aoulaiche, M., Rakowski, M., De Wachter, B., Bourdelle, K., Nguyen, B.-Y., Boedta, F., Delprat, D., Jurczak, M.

المصدر: 2009 IEEE International SOI Conference SOI Conference, 2009 IEEE International. :1-2 Oct, 2009

Relation: 2009 IEEE International SOI Conference