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1مؤتمر
المؤلفون: Huynen, M., De Zutter, D., Ginste, D. Vande, Okhmatovski, V.
المصدر: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024 Microwave Symposium - IMS 2024, 2024 IEEE/MTT-S International. :662-665 Jun, 2024
Relation: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024
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2دورية أكاديمية
المؤلفون: Bosman, D., Huynen, M., De Zutter, D., Sun, X., Pantano, N., Van der Plas, G., Beyne, E., Ginste, D.V.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(10):1567-1575 Oct, 2023
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3دورية أكاديمية
المؤلفون: Bosman, D., Huynen, M., De Zutter, D., Sun, X., Pantano, N., Van der Plas, G., Beyne, E., Vande Ginste, D.
المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 71(7):2794-2806 Jul, 2023
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4دورية أكاديمية
المؤلفون: Huynen, M., Kapusuz, K.Y., Sun, X., Van der Plas, G., Beyne, E., De Zutter, D., Vande Ginste, D.
المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 68(4):1217-1233 Apr, 2020
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5مؤتمر
المؤلفون: Huynen, M., De Zutter, D., Vande Ginste, D.
المصدر: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2018 IEEE 27th Conference on. :241-243 Oct, 2018
Relation: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
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6دورية أكاديمية
المؤلفون: Lambrecht, N., Pues, H., De Zutter, D., Ginste, D.V.
المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 60(4):858-865 Aug, 2018
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7دورية أكاديمية
المؤلفون: De Ridder, S., Manfredi, P., De Geest, J., Deschrijver, D., De Zutter, D., Dhaene, T., Vande Ginste, D.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 8(1):21-31 Jan, 2018
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8دورية أكاديمية
المؤلفون: Lambrecht, N., Pues, H., De Zutter, D., Ginste, D.V.
المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 59(2):541-544 Apr, 2017
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9دورية أكاديمية
المؤلفون: Van Londersele, A., Lee, R., Teixeira, F.L., De Zutter, D., Vande Ginste, D.
المصدر: IEEE Microwave and Wireless Components Letters IEEE Microw. Wireless Compon. Lett. Microwave and Wireless Components Letters, IEEE. 28(7):546-548 Jul, 2018
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10دورية أكاديمية
المؤلفون: Huynen, M., De Zutter, D., Vande Ginste, D.
المصدر: IEEE Microwave and Wireless Components Letters IEEE Microw. Wireless Compon. Lett. Microwave and Wireless Components Letters, IEEE. 28(6):455-457 Jun, 2018