المؤلفون: Ducharne, Benjamin, Joo, Soo-Hyun, Geslin, Pierre-Antoine, Wasniewski, Eric, Kato, Hidemi

المصدر: 2024 IEEE International Magnetic Conference - Short papers (INTERMAG Short papers) Magnetic Conference - Short papers (INTERMAG Short papers), 2024 IEEE International. :1-2 May, 2024

Relation: 2024 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers)

المؤلفون: Nishikawa, Hiroshi, Park, Byungho, Saito, Mikiko, Mizuno, Jun

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-4 Sep, 2023

Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Tan, Fu-Quan, Bai, Qing-Guo^{Aff2, Aff3, IDs12598024028315_cor2}, Yu, Bin, Wang, Jian-Feng, Zhang, Zhong-Hua^{Aff1, IDs12598024028315_cor5}

المصدر: Rare Metals. :1-13

المؤلفون: Jian, Tianzhen, Ma, Wenqing^{Aff1, Aff3, Aff4, IDs1227402464614_cor2}, Hou, Jiagang, Ma, Jianping, Li, Xianhong, Gao, Haiyang, Xu, Caixia^{Aff1, IDs1227402464614_cor7}, Liu, Hong^{Aff1, Aff3}

المصدر: Nano Research. 17(6):5206-5215

المؤلفون: Ding, Juxuan^{Aff1, Aff2}, Sun, Jifei, Ban, Boyuan, Jiang, Xuesong, Zhu, Xiaoxiao^{Aff1, Aff2}, Mo, Zhangchao^{Aff1, Aff2}, Wang, Ling, Chen, Jian^{Aff1, Aff3, IDs12633024030157_cor8}

المصدر: Silicon. :1-9

المؤلفون: Zhang, H., Jia, Q., Yin, C., Deng, Z., Guo, W., Wan, Z.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(6):897-905 Jun, 2023

المؤلفون: Shahriar, Sadi, Somayajula, Kavya, Winkeljohn, Conner, Mason, Jeremy K, Seker, Erkin

المصدر: Nanomaterials. 14(9)

مصطلحات موضوعية: Engineering, Materials Engineering, dealloying, gold thin films, porous material, elastomeric polymer, cracking, Nanotechnology, Materials engineering

URL الوصول: https://escholarship.org/uc/item/2rj8p021

المؤلفون: Viswanath, R. N.^{Aff1, IDs10934024015878_cor1}, Lakshmanan, C.^{Aff2, Aff3}, Sampath Kumar, T. S.

المصدر: Journal of Porous Materials. :1-9

المؤلفون: Bai, Qingguo^{Aff1, Aff2}, Wang, Yan, Tan, Fuquan, Zhang, Zhonghua^{Aff1, IDs122740235998y_cor4}

المصدر: Nano Research. 17(3):2011-2018

المؤلفون: Yawen Zhan, Guobin Zhang, Junda Shen, Binbin Zhou, Chenghao Zhao, Junmei Guo, Ming Wen, Zhilong Tan, Lirong Zheng, Jian Lu, Yang Yang Li

المصدر: Nano Materials Science, Vol 6, Iss 3, Pp 305-311 (2024)

مصطلحات موضوعية: Electrodeposition, Dealloying, Surface-alloyed, Noble metals, Surface enhanced Raman spectroscopy substrates, Technology, Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2589965123000193; https://doaj.org/toc/2589-9651

URL الوصول: https://doaj.org/article/8e2de8db3ae64f93a830bc5e467b1a71