المؤلفون: Li, Yuxin, Duan, Zhenxia, Wang, Jie, Zhou, Zijian, Yang, Ming, Wu, Enqi, Du, Lin

المصدر: 2023 IEEE 15th International Conference on ASIC (ASICON) ASIC (ASICON), 2023 IEEE 15th International Conference on. :1-4 Oct, 2023

Relation: 2023 IEEE 15th International Conference on ASIC (ASICON)

المؤلفون: Tian, Zhenming, Zhang, Meng, Ma, Shiqi, Sievert, Benedikt, Yuan, Hui, Lederer, Dimitri, Raskin, Jean-Pierre, Roskos, Hartmut G., Erni, Daniel, Rennings, Andreas

المصدر: 2023 Asia-Pacific Microwave Conference (APMC) Microwave Conference (APMC), 2023 Asia-Pacific. :470-472 Dec, 2023

Relation: 2023 Asia-Pacific Microwave Conference (APMC)

المؤلفون: Zhao, Heng, He, Laisheng, Feng, Junbo, Ge, Bangtong

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Alvarez, H.S., Cioldin, F.H., Silva, A.R., Espinola, L.C.J., Vaz, A.R., Diniz, J.A.

المصدر: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 30(4):668-674 Aug, 2021

المؤلفون: Delrue, Jean-Pol, Ostholt, Roman, Ambrosius, Norbert

المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-5 Sep, 2019

Relation: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Chen, Li, Wu, Heng, Zhang, Mingchuan, Jiang, Feng, Yu, Tian, Yu, Daquan

المصدر: 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-4 Aug, 2019

Relation: 2019 20th International Conference on Electronic Packaging Technology(ICEPT)

المؤلفون: Sandström, Niklas, 1981, Brandt, Ludwig, Sandoz, Patrick, Zambarda, Chiara, Guldevall, Karolin, Schulz-Ruhtenberg, M., Rösener, B., Krüger, R. A., Önfelt, Björn

المصدر: Lab on a Chip. 22(11):2107-2121

مصطلحات موضوعية: Aspect ratio, Cell culture, Clone cells, Etching, Microchannels, Microspheres, Cell culture substrate, Cell imaging, Deep etching, Imaging assays, Laser induced, Life-sciences, Living cell, Micro wells, Miniaturisation, Single cells, Glass, cell culture technique, laser, microtechnology, miniaturization, procedures, Cell Culture Techniques, Lasers

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-323848
https://doi.org/10.1039/d2lc00090c

المؤلفون: Zetian Wang, Yanming Xia, Lu Song, Jing Chen, Wei Wang

المصدر: Micromachines, Vol 15, Iss 6, p 807 (2024)

مصطلحات موضوعية: tungsten ICP deep etching, sidewall angle development, metallic hydrophobic surfaces, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/15/6/807; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/5c7707fcf697465ab623254969dc6f2c

المؤلفون: L. Kuchariková, L. Pastierovičová, E. Tillová, M. Chalupová, D. Závodská

المصدر: Archives of Metallurgy and Materials, Vol vol. 68, Iss No 2, Pp 517-524 (2023)

مصطلحات موضوعية: self-hardening alloy, mechanical properties, fatigue, deep-etching, aluminium alloy, Mining engineering. Metallurgy, TN1-997, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: https://journals.pan.pl/Content/127276/PDF/AMM-2023-2-14-Pastierovicova.pdf; https://doaj.org/toc/2300-1909

URL الوصول: https://doaj.org/article/0f5c44aedd6c48799ca7503fbc5bf433

المؤلفون: Eva Tillová, Mária Chalupová, Lenka Kuchariková, Mirosław Bonek, Milan Uhríčik, Lucia Pastierovičová

المصدر: Bulletin of the Polish Academy of Sciences: Technical Sciences, Vol 71, Iss 2 (2023)

مصطلحات موضوعية: al-si cast alloy, primary silicon, deep etching, morphology, Technology, Technology (General), T1-995

وصف الملف: electronic resource

Relation: https://journals.pan.pl/Content/126615/PDF/BPASTS_2023_71_2_3370.pdf; https://doaj.org/toc/2300-1917

URL الوصول: https://doaj.org/article/0a54285c94fe4978b5e876c706b85101