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1مؤتمر
المؤلفون: Wang, Lei, Liu, Jinhai, Qu, Fuming, Zuo, Fengyuan, Jiang, Lin, Shen, XiangKai
المصدر: 2022 34th Chinese Control and Decision Conference (CCDC) Control and Decision Conference (CCDC), 2022 34th Chinese. :169-174 Aug, 2022
Relation: 2022 34th Chinese Control and Decision Conference (CCDC)
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2مؤتمر
المؤلفون: Zhang, Hewei
المصدر: 2022 7th International Conference on Big Data Analytics (ICBDA) Big Data Analytics (ICBDA), 2022 7th International Conference on. :78-83 Mar, 2022
Relation: 2022 7th International Conference on Big Data Analytics (ICBDA)
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3كتاب إلكتروني
المؤلفون: Chatterjee, ShaunakAff12, Deb, ArghyaAff12
المساهمون: di Prisco, Marco, Series EditorAff1, Chen, Sheng-Hong, Series EditorAff2, Vayas, Ioannis, Series EditorAff3, Kumar Shukla, Sanjay, Series EditorAff4, Sharma, Anuj, Series EditorAff5, Kumar, Nagesh, Series EditorAff6, Wang, Chien Ming, Series EditorAff7, Cui, Zhen-Dong, Series EditorAff8, Goel, Manmohan Dass, editorAff9, Kumar, Ratnesh, editorAff10, Gadve, Sangeeta S., editorAff11
المصدر: Recent Developments in Structural Engineering, Volume 1. 52:665-673
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4دورية أكاديمية
المؤلفون: Sanghyeon Cho, Wonseok Chung, Woo-tai Jung, Jong-sup Park, Heeyoung Lee
المصدر: Case Studies in Construction Materials, Vol 20, Iss , Pp e02743- (2024)
مصطلحات موضوعية: Prestressed near-surface-mounted, Anchorage device, Shear capacity, Defect depth, Finite element analysis, Materials of engineering and construction. Mechanics of materials, TA401-492
وصف الملف: electronic resource
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5دورية أكاديمية
المؤلفون: Sheng Bao, Yan Li, Qiang Luo, Jingxuan Hong
المصدر: Results in Engineering, Vol 22, Iss , Pp 102297- (2024)
مصطلحات موضوعية: Metal magnetic memory, Defect depth, Double defect, Characteristic parameter, Pipeline steels, Technology
وصف الملف: electronic resource
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6دورية أكاديمية
المؤلفون: Lu, Yeping, Wang, Yiwen, Chai, Ying, Chen, MinjieAff1, IDs00784023052247_cor4
المصدر: Clinical Oral Investigations. 27(10):6089-6096
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7مؤتمر
المؤلفون: Li, Hong-Mei, Huang, Ran-Ran, Zhao, Chun-Tian, Yan, Jia, Wang, Yu
المصدر: 2020 IEEE Far East NDT New Technology & Application Forum (FENDT) New Technology & Application Forum (FENDT), 2020 IEEE Far East NDT. :1-5 Nov, 2020
Relation: 2020 IEEE Far East NDT New Technology & Application Forum (FENDT)
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8دورية أكاديمية
المؤلفون: Yi, Q., Malekmohammadi, H., Tian, G.Y., Laureti, S., Ricci, M.
المصدر: IEEE Transactions on Industrial Informatics IEEE Trans. Ind. Inf. Industrial Informatics, IEEE Transactions on. 16(6):3963-3973 Jun, 2020
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9دورية أكاديمية
المؤلفون: Bao, ShengAff1, IDs1092102300960y_cor1, Li, Yan, Luo, Qiang
المصدر: Journal of Nondestructive Evaluation. 42(2)
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10مؤتمر
المصدر: 2016 International Conference on Electrical Sciences and Technologies in Maghreb (CISTEM) Electrical Sciences and Technologies in Maghreb (CISTEM), 2016 International Conference on. :1-7 Oct, 2016
Relation: 2016 International Conference on Electrical Sciences and Technologies in Maghreb (CISTEM)