-
1دورية أكاديمية
المؤلفون: Ouhab, M., Degrenne, N., Ito, Y.
المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 39(1):1482-1491 Jan, 2024
-
2مؤتمر
المؤلفون: Degrenne, N., Mollov, S.
المصدر: 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Integrated Power Packaging (IWIPP), 2019 IEEE International Workshop on. :107-116 Apr, 2019
Relation: 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)
-
3دورية أكاديمية
المؤلفون: Caillaud, R., Buttay, C., Mrad, R., Le Lesle, J., Morel, F., Degrenne, N., Mollov, S.V.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(2):230-239 Feb, 2020
-
4مؤتمر
المؤلفون: Degrenne, N., Mollov, S.
المصدر: IECON 2016 - 42nd Annual Conference of the IEEE Industrial Electronics Society Industrial Electronics Society , IECON 2016 - 42nd Annual Conference of the IEEE. :2177-2182 Oct, 2016
Relation: IECON 2016 - 42nd Annual Conference of the IEEE Industrial Electronics Society
-
5مؤتمر
المؤلفون: Degrenne, N., Delamea, R., Mollov, S.
المصدر: 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe) Power Electronics and Applications (EPE'20 ECCE Europe), 2020 22nd European Conference on. :P.1-P.8 Sep, 2020
Relation: 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)
-
6مؤتمر
المؤلفون: Adami, S-E., Degrenne, N., Vollaire, C., Allard, B., Buret, F., Costa, F.
المصدر: 2011 18th IEEE International Conference on Electronics, Circuits, and Systems Electronics, Circuits and Systems (ICECS), 2011 18th IEEE International Conference on. :398-401 Dec, 2011
Relation: 2011 18th IEEE International Conference on Electronics, Circuits and Systems - (ICECS 2011)
-
7دورية أكاديمية
المؤلفون: Dornic, N., Ibrahim, A., Khatir, Z., Degrenne, N., Mollov, S., Ingrosso, D.
المصدر: In Microelectronics Reliability November 2020 114
-
8دورية أكاديمية
المؤلفون: Ibrahim, A., Khatir, Z., Ousten, J.P., Lallemand, R., Degrenne, N., Mollov, S., Ingrosso, D.
المصدر: In Microelectronics Reliability November 2020 114
-
9دورية أكاديميةWire-bond contact degradation modeling for remaining useful lifetime prognosis of IGBT power modules
المؤلفون: Nazar, M., Ibrahim, A., Khatir, Z., Degrenne, N., Al-Masry, Z.
المصدر: In Microelectronics Reliability November 2020 114
-
10دورية أكاديمية
المؤلفون: Degrenne, N., Marian, V., Vollaire, C., Buret, F., Verdier, J., Allard, B.
المصدر: IEEE Antennas and Wireless Propagation Letters Antennas Wirel. Propag. Lett. Antennas and Wireless Propagation Letters, IEEE. 11:941-944 2012
Full Text Finder