المؤلفون: Lhostis, S.^{Aff1, IDs11664024111381_cor1}, Ayoub, B.^{Aff1, Aff2}, Sart, C., Moreau, S., Souchier, E., Gusmao Cacho, M. G., Deloffre, E., Mermoz, S., Rey, C., Le Roux, F., Aybeke, E., Gallois-Garreignot, S., Frémont, H., Tournier, A.

المصدر: Journal of Electronic Materials. 53(8):4421-4431

المؤلفون: Ayoub, B., Lhostis, S., Moreau, S., Perez, E. Leon, Jourdon, J., Lamontagne, P., Deloffre, E., Mermoz, S., de Buttet, C., Balan, V., Euvard, C., Exbrayat, Y., Fremont, H.

المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :453-458 Dec, 2020

Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

المؤلفون: Sart, C., Estevez, R., Fiori, V., Lhostis, S., Deloffre, E., Parry, G., Gonella, R.

المصدر: 2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-7 Sep, 2016

Relation: 2016 6th Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Lhostis, S., Farcy, A., Deloffre, E., Lorut, F., Mermoz, S., Henrion, Y., Berthier, L., Bailly, F., Scevola, D., Guyader, F., Gigon, F., Besset, C., Pellissier, S., Gay, L., Hotellier, N., Le Berrigo, A. -L., Moreau, S., Balan, V., Fournel, F., Jouve, A., Cheramy, S., Arnoux, M., Rebhan, B., Maier, G. A., Chitu, L.

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :869-876 May, 2016

Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

المؤلفون: Rebhan, B., Bernauer, M., Wagenleitner, T., Heilig, M., Kurz, F., Lhostis, S., Deloffre, E., Jouve, A., Balan, V., Chitu, L.

المصدر: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-4 Dec, 2015

Relation: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

المؤلفون: Mermoz, S., Sanchez, L., Di Cioccio, L., Berthier, J., Deloffre, E., Coudrain, P., Fretigny, C.

المصدر: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th. :162-167 Dec, 2013

Relation: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

المؤلفون: Jourdon, J., Lhostis, S., Moreau, S., Chossat, J., Arnoux, M., Sart, C., Henrion, Y., Lamontagne, P., Arnaud, L., Bresson, N., Balan, V., Euvrard, C., Exbrayat, Y., Scevola, D., Deloffre, E., Mermoz, S., Martin, A., Bilgen, H., Andre, F., Charles, C., Bouchu, D., Farcy, A., Guillaumet, S., Jouve, A., Fremont, H., Cheramy, S.

المصدر: 2018 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2018 IEEE International. :7.3.1-7.3.4 Dec, 2018

Relation: 2018 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Mermoz, S., Sanchez, L., Di Cioccio, L., Berthier, J., Deloffre, E., Fretigny, C.

المصدر: 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. :1-5 Jan, 2012

Relation: 2011 IEEE International 3D Systems Integration Conference (3DIC)

المؤلفون: Le Cunff, D., Pravdivtsev, A., Le Chao, K., Couvrat, S., Euvrard, C., Deloffre, E., Cailean, A.

المصدر: 2010 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2010 IEEE International. :1-6 Nov, 2010

Relation: 2010 IEEE International 3D Systems Integration Conference (3DIC)

المؤلفون: Arnaud, L., Moreau, S., Jouve, A., Jani, I., Lattard, D., Fournel, F., Euvrard, C., Exbrayat, Y., Balan, V., Bresson, N., Lhostis, S., Jourdon, J., Deloffre, E., Guillaumet, S., Farcy, A., Gousseau, S., Arnoux, M.

المصدر: 2018 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2018 IEEE International. :4D.4-1-4D.4-7 Mar, 2018

Relation: 2018 IEEE International Reliability Physics Symposium (IRPS)