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1دورية أكاديمية
المؤلفون: Wenchao Wang, Ziyu Liu, Delong Qiu, Zhiyuan Zhu, Na Yan, Shijin Ding, David Wei Zhang
المصدر: Micromachines, Vol 14, Iss 12, p 2242 (2023)
مصطلحات موضوعية: flip chip, Au-Sn, solid-state diffusion (SSD), thermal gradient bonding (TGB), intermetallic compound (IMC), Mechanical engineering and machinery, TJ1-1570
وصف الملف: electronic resource
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2مؤتمر
المؤلفون: Wang, Huijuan, Zhou, Jing, Song, Chongshen, Yu, Daquan, Dai, Fengwei, Guidotti, Daniel, Song, Yang, Jie, Pan, Delong, Qiu, Huimin, He, Peng, Wu, Du, Tianmin, Cao, Liqiang, Wan, Lixi
المصدر: 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :41-45 Aug, 2013
Relation: 2013 14th International Conference on Electronic Packaging Technology (ICEPT)
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3
المؤلفون: Huijing Tan, Lan Shen, Yue Zuo, Lisheng Fan, Gengchao Zhang, Delong Qiu, Lanlan Xie, Xiuhua Zheng, Wei He
المصدر: Journal of Petroleum Science and Engineering. 215:110704
مصطلحات موضوعية: Fuel Technology, Geotechnical Engineering and Engineering Geology
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4
المؤلفون: Delong Qiu, Qidong Wang, Liqiang Cao, Fengze Hou, Xugang Wang
المصدر: Microelectronics Reliability. 74:34-43
مصطلحات موضوعية: Air cooling, Engineering, business.product_category, Natural convection, Convective heat transfer, business.industry, 020209 energy, Thermal resistance, Mechanical engineering, 020206 networking & telecommunications, 02 engineering and technology, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Forced convection, Thermocouple, Thermal, 0202 electrical engineering, electronic engineering, information engineering, Die (manufacturing), Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, business
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5
المؤلفون: Haiyun Xue, Delong Qiu, Fengman Liu, Huimin He, Haidong Wang, Liqiang Cao, Baoxia Li, Yunyan Zhou
المصدر: Fiber and Integrated Optics. 35:212-229
مصطلحات موضوعية: Hardware_MEMORYSTRUCTURES, Flat memory model, business.industry, Computer science, Registered memory, Uniform memory access, 020206 networking & telecommunications, Semiconductor memory, 02 engineering and technology, Memory controller, Atomic and Molecular Physics, and Optics, Fully Buffered DIMM, Electronic, Optical and Magnetic Materials, 020210 optoelectronics & photonics, Embedded system, 0202 electrical engineering, electronic engineering, information engineering, Interleaved memory, business, Computer hardware, Computer memory
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6
المؤلفون: Delong Qiu, Qidong Wang, Mei Xue, Jun Li, Liqiang Cao
المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Physics, Radio transmitter design, Beam diameter, business.industry, 020208 electrical & electronic engineering, 020206 networking & telecommunications, 02 engineering and technology, Microstrip, Absolute gain, Antenna array, Printed circuit board, Optics, Band-pass filter, 0202 electrical engineering, electronic engineering, information engineering, Radio frequency, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6f4ed80b6a297283470feed4fbdafcc0
https://doi.org/10.1109/ectc.2018.00042 -
7
المؤلفون: Fengze Hou, Fengman Liu, Cheng Chen, Qidong Wang, Liqiang Cao, Meiying Su, Lixi Wan, Delong Qiu
المصدر: 2016 17th International Conference on Electronic Packaging Technology (ICEPT).
مصطلحات موضوعية: 010302 applied physics, Engineering, Natural convection, Fin, business.industry, Mechanical engineering, 02 engineering and technology, Dissipation, Computational fluid dynamics, 021001 nanoscience & nanotechnology, Cooling capacity, 01 natural sciences, Thermal conductivity, 0103 physical sciences, Thermal, Electronic engineering, Electronics, 0210 nano-technology, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fbc91e82ecab192585f45b8ea1d45340
https://doi.org/10.1109/icept.2016.7583205 -
8
المؤلفون: Delong Qiu, Fen gze Hou, Qidong Wang, Liqiang Cao, Wu Xiaomeng, Jing Zhang
المصدر: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Thermal transmittance, Materials science, Thermal resistance, Thermal, Water cooling, Immersion (virtual reality), Electronic engineering, Thermal management of electronic devices and systems, Composite material, Thermal conduction, Finite element method
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::15ae33ba581d37c2d0d3fc7ecf3130c4
https://doi.org/10.1109/ectc.2015.7159690 -
9
المؤلفون: Daquan Yu, Dongkai Shangguan, Yuan Lu, Huijuan Wang, Delong Qiu, Jie Pan, Xiaoli Ren
المصدر: 2014 15th International Conference on Electronic Packaging Technology.
مصطلحات موضوعية: Engineering, business.industry, Electrical engineering, Structure (category theory), Hardware_PERFORMANCEANDRELIABILITY, Solid modeling, Inductor, Circuit modeling, Inductance, Quality (physics), Q factor, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Lower cost, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::33dc3cb4e08612696e0b7aaa57c65584
https://doi.org/10.1109/icept.2014.6922873 -
10
المؤلفون: Laicun Lin, Mingchuan Zhang, Feng Jiang, Delong Qiu, Xiangmeng Jing, Daquan Yu
المصدر: 2014 15th International Conference on Electronic Packaging Technology.
مصطلحات موضوعية: Microelectromechanical systems, Argon, Materials science, Glass etching, chemistry, Silicon, Etching (microfabrication), Analytical chemistry, chemistry.chemical_element, Dry etching, Reactive-ion etching, Inductively coupled plasma
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c7bba9971ed3d46e836f7d2171079ea8
https://doi.org/10.1109/icept.2014.6922667
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