المؤلفون: Bian, M., Shi, Y., Huang, X.

المصدر: IEEE Transactions on Vehicular Technology IEEE Trans. Veh. Technol. Vehicular Technology, IEEE Transactions on. 73(5):6546-6559 May, 2024

المؤلفون: Singh, Vijay, Bhagwan, Shri, Sharma, Sanghmitra, Kumar, V. Mathan, Gopinath, S., Dedgaonkar, Suruchi Gaurav

المصدر: 2023 International Conference on Power Energy, Environment & Intelligent Control (PEEIC) Power Energy, Environment & Intelligent Control (PEEIC), 2023 International Conference on. :616-620 Dec, 2023

Relation: 2023 International Conference on Power Energy, Environment & Intelligent Control (PEEIC)

المؤلفون: He, Huiqian, He, Yuan, Fu, Tieming, Tao, Hui

المصدر: 2023 16th International Symposium on Computational Intelligence and Design (ISCID) ISCID Computational Intelligence and Design (ISCID), 2023 16th International Symposium on. :114-117 Dec, 2023

Relation: 2023 16th International Symposium on Computational Intelligence and Design (ISCID)

المؤلفون: Bockle, Martin, Booler-Stewart, Flynn, Woolsey, Kristi

المصدر: 2023 IEEE International Conference on Metaverse Computing, Networking and Applications (MetaCom) METACOM Metaverse Computing, Networking and Applications (MetaCom), 2023 IEEE International Conference on. :99-103 Jun, 2023

Relation: 2023 IEEE International Conference on Metaverse Computing, Networking and Applications (MetaCom)

المؤلفون: Zhang, Yuxin^{Aff1, Aff2}, Zuo, Zhitao^{Aff1, Aff2, Aff3}, Guo, Wenbin, Liang, Qi, Chen, Haisheng^{Aff1, Aff2, Aff3, Aff4, IDs116300241899y_cor5}

المصدر: Journal of Thermal Science. 33(3):872-887

المؤلفون: Wei, Yingdong, Wei, Yiheng, Chen, Yuquan, Wang, Yong

المصدر: 2022 China Automation Congress (CAC) Automation Congress (CAC), 2022 China. :374-379 Nov, 2022

Relation: 2022 China Automation Congress (CAC)

المؤلفون: Chang, Fu-Hsiang, Chang, Kuo-Chi, Wang, Hsiao-Chuan

المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Randall, Natasha^{Aff1, IDs1236902301093y_cor1}, Šabanović, Selma

المصدر: International Journal of Social Robotics. 16(3):461-487

المؤلفون: Guo, Biao, Jin, Fei^{Aff1, Aff2}, Li, Li, Pan, Zi-Zhao, Xu, Xin-Wei, Wang, Hong^{Aff1, Aff2, IDs12598023024524_cor6}

المصدر: Rare Metals. 43(3):853-878

المؤلفون: Xiong, Jing-Peng, Zeng, Yi-Qi^{Aff1, Aff2}, Liu, Jin-Long, Wang, Wei-Cheng, Luo, Lan^{Aff1, Aff2}, Liu, Yong^{Aff1, IDs40195023015605_cor6}

المصدر: Acta Metallurgica Sinica (English Letters). 37(3):467-483