المؤلفون: Lu, D., Wang, X., Pan, H., Zheng, X., Li, M., Ji, H.

المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 39(5):6040-6051 May, 2024

المؤلفون: Mysliwiec, Marcin, Kisiel, Ryszard

المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-5 May, 2023

Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)

المؤلفون: Chuang, Tung-Han^{Aff1, Aff2, IDs1166402310905w_cor1}, Lin, Ang-Ying^{Aff1, Aff3}, Chen, Yen-Ting, Chen, Yin-Hsuan, Yang, Zi-Hong, Wu, Po-Ching^{Aff1, Aff4}

المصدر: Journal of Electronic Materials. 53(5):2583-2590

المؤلفون: Agyakwa, Pearl A.^{Aff1, IDs11664023108704_cor1}, Robertson, Stuart, Dai, Jingru, Mouawad, Bassem, Zhou, Zhaoxia, Liu, Changqing, Johnson, C. Mark

المصدر: Journal of Electronic Materials. 53(3):1374-1398

المؤلفون: Gharaibeh, Mohammad A., Wilde, Jürgen

المصدر: International Journal of Structural Integrity, 2024, Vol. 15, Issue 4, pp. 702-716.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/IJSI-01-2024-0005

المؤلفون: Guo, Rumeng, Zhou, Shiqi, Gao, Yue, Liu, Zhi-Quan, Sun, Rong

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Chen, Haixue, Zhang, Jing, Zhang, Guoqi, Liu, Pan

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Fan, Zhibin, Qiao, Zhen, Lei, Guangyin

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Wang, Chun-Meng, Hou, Bin, Deng, Yun-Kai, Zhou, Min-Bo, Zhang, Xin-Ping

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Zhang, Yudui, Zhang, Xu, Wang, Chuncheng, Zhu, Pengli, Xiang, Bin, Zhao, Tao, Xu, Liang, Sun, Rong

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)