المؤلفون: Scott, Travis

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-5 Sep, 2023

Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Wang, Z., Li, X.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(9):1494-1501 Sep, 2023

المؤلفون: Lucas, T. J.^{Aff1, IDs10909024031042_cor1}, Biesecker, J. P., Doriese, W. B., Duff, S. M., Durkin, M. S.^{Aff1, Aff2}, Lew, R. A.^{Aff1, Aff3}, Ullom, J. N.^{Aff1, Aff2}, Vissers, M. R., Schmidt, D. R.

المصدر: Journal of Low Temperature Physics. 216(1-2):67-72

المؤلفون: Chuang, Tung-Han^{Aff1, Aff2, IDs1166502308441z_cor1}, Yang, Zi-Hong, Chen, Yen-Ting, Chen, Yin-Hsuan

المصدر: Journal of Materials Engineering and Performance. 33(14):7290-7298

المؤلفون: Rodrigues, Augusto, Roshanghias, Ali

المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-4 May, 2023

Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)

المؤلفون: Furukawa, Yoshiki, Miyawaki, Manabu, Miura, Susumu, Shizuhata, Hironori, Saiki, Naoya

المصدر: 2022 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2022 IEEE. :84-87 Nov, 2022

Relation: 2022 IEEE CPMT Symposium Japan (ICSJ)

المؤلفون: Shi, Lin, Wang, Chong, Cai, Xiaolong, Cao, Zhengya, Ma, Xiaohua, Duan, Xiangyang

المصدر: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-4 Jul, 2022

Relation: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Liu, Yangming, Wang, Xu, Liu, Xiangyang, Huang, Shenghua, Chiu, Chin-Tien, Ye, Ning, Yang, Bo

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :513-518 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Lin, Yung-Sheng, Hung, Yun-Ching, Kao, Chin-Li, Lai, Chung-Hung, Shih, Po-Shao, Huang, Jeng-Hau, Tarng, David, Kao, C. Robert

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :177-181 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Hu, Liangxing, Lim, Yu Dian, Zhao, Peng, Zhong Lim, Michael Joo, Seng Tan, Chuan

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :324-329 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)