المؤلفون: Dimcic, Biljana, De Messemaeker, Joke, Zhang, Wenqi, Kristof, Croes, Vanstreels, Kris, Verlinden, Bert, DeWolf, Ingrid

المصدر: 2012 4th Electronic System-Integration Technology Conference Electronic System-Integration Technology Conference (ESTC), 2012 4th. :1-4 Sep, 2012

Relation: 2012 4th Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Croes, Kristof, Cherman, Vladimir O., Li, Yunlong, Zhao, Larry, Barbarin, Yohan, De Messemaeker, Joke, Civale, Yann, Velenis, Dimitrios, Stucchi, Michele, Kauerauf, Thomas, Redolfi, Augusto, Dimcic, Biljana, Ivankovic, Andrej, Van der Plas, Geert, De Wolf, Ingrid, Beyer, Gerald, Swinnen, Bart, Tokei, Zsolt, Beyne, Eric

المصدر: 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the. :1-5 Jul, 2012

Relation: 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012)

المؤلفون: Hsu, Yung-Yu, Dimcic, Biljana, Gonzalez, Mario, Bossuyt, Frederick, Vanfleteren, Jan, De Wolf, Ingrid

المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International. :1-4 Oct, 2010

Relation: 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Dimcic, Biljana, Labie, Riet, Wenqi Zhang, De Wolf, Ingrid, Verlinden, Bert

المصدر: 3rd Electronics System Integration Technology Conference ESTC Electronic System-Integration Technology Conference (ESTC), 2010 3rd. :1-5 Sep, 2010

Relation: 2010 3rd Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Agarwal, Rahul, Zhang, Wenqi, Limaye, Paresh, Labie, Riet, Dimcic, Biljana, Phommahaxay, Alain, Soussan, Philippe

المصدر: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. :858-863 Jun, 2010

Relation: 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

المؤلفون: Vakanas, George, Minho, O., Dimcic, Biljana, Vanstreels, Kris, Vandecasteele, Bjorn, De Preter, Inge, Derakhshandeh, Jaber, Rebibis, Kenneth, Kajihara, Masanori, De Wolf, Ingrid, Beyne, Eric

المصدر: In Microelectronic Engineering 1 June 2015 140:72-80

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المؤلفون: Vakanas, George, Dimcic, Biljana, O, Minho, Vanstreels, Kris, Vandecasteele, Bjorn, De Preter, Inge, Derakhshandeh, Jaber, Rebibis, Kenneth, Kajihara, Masanori, De Wolf, Ingrid, Beyne, Eric

مصطلحات موضوعية: Materials science, Diffusion barrier, Metallurgy, Intermetallic, Solder paste, chemistry.chemical_element, Lead-free solders, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Metallization and barrier materials, chemistry, Chemical engineering, X-ray photoelectron spectroscopy, Soldering, 3D interconnects, Wetting, Electrical and Electronic Engineering, Cobalt窶典in (Co窶鉄n), Cobalt窶典in intermetallics (Co窶鉄n IMC), Electroplating, Cobalt

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8cd1ec2b797b5802f129bb400bb50b88
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100699417

المؤلفون: O, Minho, Vakanas, George, Dimcic, Biljana, Kajihara, Masanori

المصدر: Proceedings of Advanced Metallization Conference (ADMETA plus) 2013.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=jairo_______::fd40a94c70468968284c753769dc7cae
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100699404

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