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1دورية أكاديمية
المؤلفون: Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, Ioannis Theodorakos, Dimitris Reppas, Nikolaos Oikonomidis, Christos Spandonidis, Ioanna Zergioti
المصدر: Materials, Vol 14, Iss 12, p 3353 (2021)
مصطلحات موضوعية: Laser-Induced Forward Transfer, lead-free solder paste, PCB assembly, printed micropatterns, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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2مؤتمر
المؤلفون: Dimitrios, Spyropoulos, Fotios, Giannopoulos, Emmanouil, Sotiropoulos, Areti, Petsa, Dimitris, Reppas, Christos, Spandonidis C.
المصدر: 2021 1st Conference on Online Teaching for Mobile Education (OT4ME) Online Teaching for Mobile Education (OT4ME), 2021 1st Conference on. :138-145 Nov, 2021
Relation: 2021 1st Conference on Online Teaching for Mobile Education (OT4ME)
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3مؤتمر
المؤلفون: Christos, Spandonidis C., Fotis, Giannopoulos, Nektarios, Galiatsatos, Dimitris, Reppas, Areti, Petsa, Dimitrios, Spyropoulos
المصدر: 2021 10th International Conference on Modern Circuits and Systems Technologies (MOCAST) Modern Circuits and Systems Technologies (MOCAST), 2021 10th International Conference on. :1-4 Jul, 2021
Relation: 2021 10th International Conference on Modern Circuits and Systems Technologies (MOCAST)
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المؤلفون: Christos Spandonidis, Fotis Giannopoulos, Elias Sedikos, Dimitris Reppas, Panayiotis Theodoropoulos
المصدر: IEEE Transactions on Instrumentation and Measurement. 71:1-8
مصطلحات موضوعية: Electrical and Electronic Engineering, Instrumentation
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المؤلفون: Ioanna Zergioti, Panagiotis Papadopoulos, Nikolaos Oikonomidis, Filimon Zacharatos, Dimitris Reppas, Marina Makrygianni, Ioannis Theodorakos, Christos Spandonidis
المصدر: Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI.
مصطلحات موضوعية: Surface-mount technology, Interconnection, Printed circuit board, Materials science, business.industry, Soldering, Optoelectronics, Solder paste, Microelectronics, Process optimization, business, Layer (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c955707aba6d7ce3d21aa8f82a24340c
https://doi.org/10.1117/12.2577693 -
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المؤلفون: Christos Spandonidis, Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, Ioannis Theodorakos, Ioanna Zergioti, Nikolaos Oikonomidis, Dimitris Reppas
المصدر: Materials
Materials, Vol 14, Iss 3353, p 3353 (2021)
Volume 14
Issue 12مصطلحات موضوعية: Technology, Materials science, Hardware_PERFORMANCEANDRELIABILITY, Laser-Induced Forward Transfer, Article, printed micropatterns, Cable gland, Printed circuit board, Hardware_INTEGRATEDCIRCUITS, Deposition (phase transition), General Materials Science, Microscopy, QC120-168.85, Stencil printing, business.industry, QH201-278.5, Solder paste, Engineering (General). Civil engineering (General), PCB assembly, Line (electrical engineering), TK1-9971, lead-free solder paste, Descriptive and experimental mechanics, Soldering, visual_art, Electronic component, visual_art.visual_art_medium, Optoelectronics, Electrical engineering. Electronics. Nuclear engineering, TA1-2040, business, Hardware_LOGICDESIGN
وصف الملف: application/pdf