المؤلفون: Cai, Han, Wu, Yongjin, Xie, DongDong, Luo, Jiangbo, Zhang, Yanxin, Sun, Yunna, Yang, Zhuoqing, Ding, Guifu

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :722-726 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Zhang, Mingyu, Yin, Tan, Hu, Zhiyuan, Wang, Mengcheng, Huang, Haokai, Zhang, Yanxin, Hao, Yongcun, Chang, Honglong, Wang, Yan, Sun, Yunna, Yang, Zhuoqing, Ding, Guifu

المصدر: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2024 IEEE 37th International Conference on. :733-736 Jan, 2024

Relation: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Yin, Tan, Sun, Yunna, Wang, Yan, Ding, Guifu, Zhang, Mingyu

المصدر: 2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) Nano/Micro Engineered and Molecular Systems (NEMS), 2023 IEEE 18th International Conference on. :78-81 May, 2023

Relation: 2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

المؤلفون: Sun, Yunna, Ma, Chuangbei, Cai, Han, Zheng, Ruin, Zhang, Di, Wang, Yan, Ding, Guifu

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1571-1576 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Sun, Yunna, Wu, Yongpeng, Li, Hongfang, Wang, Yan, Yang, Zhuoqing, Fu, Yuzhuo, Ding, Guifu

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1608-1613 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Wang, Kai, Shao, Xiufeng, Dai, Xuhan, Yang, Zhuoqing, Ding, Guifu, Zhao, Xiaolin

المصدر: 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2020 IEEE 33rd International Conference on. :271-274 Jan, 2020

Relation: 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Zhao, Yuecen, li, Li, Wang, Quansheng, Ding, Guifu, Zhang, Congchun

المصدر: In Ceramics International 1 July 2024 50(13) Part A:22165-22173

المؤلفون: Cai, Han, Li, Yahui, Zhang, Haodong, Zhang, Yanxin, Li, Chenyuan, Wu, Yongjin, Sun, Yunna, Yang, Zhuoqing, Ding, Guifu

المصدر: In Journal of Materials Research and Technology May-June 2024 30:7429-7439

المؤلفون: Zhang, Yanxin, Lai, Liyan, Cui, Dongyu, Zhu, Yuan, Cai, Han, Yan, Bo, Li, Yahui, Yang, Zhuoqing, Ding, Guifu

المصدر: In Ceramics International 1 May 2024 50(9) Part B:16553-16563

المؤلفون: Wang, Guilian, Wang, Zhichun, Lai, Liyan, Xie, Dongdong, Zhu, Yuan, Ding, Guifu, Xu, Qiu

المصدر: In Case Studies in Thermal Engineering August 2024 60