يعرض 1 - 10 نتائج من 362 نتيجة بحث عن '"Ding, Zhongxiang"', وقت الاستعلام: 1.37s تنقيح النتائج
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    مؤتمر

    المصدر: 2023 IEEE 20th International Symposium on Biomedical Imaging (ISBI) Biomedical Imaging (ISBI), 2023 IEEE 20th International Symposium on. :1-4 Apr, 2023

    Relation: 2023 IEEE 20th International Symposium on Biomedical Imaging (ISBI)

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    مؤتمر

    المصدر: 2023 IEEE 20th International Symposium on Biomedical Imaging (ISBI) Biomedical Imaging (ISBI), 2023 IEEE 20th International Symposium on. :1-4 Apr, 2023

    Relation: 2023 IEEE 20th International Symposium on Biomedical Imaging (ISBI)

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    مؤتمر

    المصدر: 2022 IEEE 19th International Symposium on Biomedical Imaging (ISBI) Biomedical Imaging (ISBI), 2022 IEEE 19th International Symposium on. :1-4 Mar, 2022

    Relation: 2022 IEEE 19th International Symposium on Biomedical Imaging (ISBI)

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    كتاب إلكتروني

    المؤلفون: Yang, YimengAff12, Aff14, Gu, DongdongAff12, Zhang, XukunAff16, Ding, ZhongxiangAff17, Gao, FeiAff14, Xue, ZhongAff12, Shen, DinggangAff12, Aff13, Aff15

    المساهمون: Goos, Gerhard, Founding EditorAff1, Hartmanis, Juris, Founding EditorAff2, Bertino, Elisa, Editorial Board MemberAff3, Gao, Wen, Editorial Board MemberAff4, Steffen, Bernhard, Editorial Board MemberAff5, Yung, Moti, Editorial Board MemberAff6, Cao, Xiaohuan, editorAff7, Xu, Xuanang, editorAff8, Rekik, Islem, editorAff9, Cui, Zhiming, editorAff10, Ouyang, Xi, editorAff11

    المصدر: Machine Learning in Medical Imaging : 14th International Workshop, MLMI 2023, Held in Conjunction with MICCAI 2023, Vancouver, BC, Canada, October 8, 2023, Proceedings, Part I. 14348:33-41

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    مؤتمر

    المؤلفون: Ding, Zhongxiang, Qi, Yali, Lin, Deping

    المصدر: 2021 4th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE) AEMCSE Advanced Electronic Materials, Computers and Software Engineering (AEMCSE), 2021 4th International Conference on. :1243-1246 Mar, 2021

    Relation: 2021 4th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE)

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    دورية أكاديمية

    المؤلفون: Ge, XiuhongAff1, Aff2, Wang, LuoyuAff1, Aff2, Pan, Lei, Ye, Haiqi, Zhu, Xiaofen, Fan, Sandra, Feng, Qi, Du, QuanAff4, IDs1019402301544x_cor8, Yu, WenhuaAff4, IDs1019402301544x_cor9, Ding, ZhongxiangAff1, Aff2, IDs1019402301544x_cor10

    المصدر: The Journal of Headache and Pain: Official Journal of the "European Headache Federation" and of "Lifting The Burden - The Global Campaign against Headache". 24(1)

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