المؤلفون: Zhao, Y., Basaran, C., Cartwright, A., Dishongh, T.

المصدر: Journal of the Mechanical Behavior of Materials, Vol 10, Iss 3, Pp 135-146 (1999)

مصطلحات موضوعية: Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://doaj.org/toc/0334-8938; https://doaj.org/toc/2191-0243

URL الوصول: https://doaj.org/article/5662fbd30ed647799e5f1f07f2270b40

المؤلفون: Hossain, M.M., Yongje Lee, Akhter, R., Agonafer, D., Dishongh, T.

المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :1088-1096 2006

Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems

المؤلفون: Hossain, M.M., Yongje Lee, Akhter, R., Agonafer, D., Pekin, S., Dishongh, T.

المصدر: Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE. :222-229 2006

Relation: Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium

المؤلفون: Bin Lian, Dishongh, T., Pullen, D., Hongfei Yan, Jing Chen

المصدر: ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on. 1:78-81 2000

Relation: ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

المؤلفون: Zhao, Y., Basaran, C., Cartwright, A., Dishongh, T.

المصدر: ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on. 2:174-180 vol. 2 2000

Relation: ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

المؤلفون: Zhao, Y., Basaran, C., Cartwright, A., Dishongh, T.

المصدر: ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on. 2:349-355 vol. 2 2000

Relation: ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

المؤلفون: Titus, A., Jaiswal, B., Dishongh, T.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 27(4):630-639 Nov, 2004

المؤلفون: Dishongh, T., Basaran, C., Cartwright, A.N., Ying Zhao, Heng Liu

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 25(3):433-438 Aug, 2002

المؤلفون: Desai, C.S., Basaran, C., Dishongh, T., Prince, J.L.

المصدر: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B IEEE Trans. Comp., Packag., Manufact. Technol. B Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on. 21(1):87-97 Feb, 1998

المؤلفون: Dewan-Sandur, B.P., Kaisare, A., Agonafer, De., Agonafer, Da., Amon, C., Pekin, S., Dishongh, T.

المصدر: 56th Electronic Components and Technology Conference 2006 Electronic Components & Technology Electronic Components and Technology Conference, 2006. Proceedings. 56th. :6 pp. 2006

Relation: 2006 Proceedings. 56th Electronic Components & Technology Conference