المؤلفون: Denkena, B.^{Aff1, Aff3}, Dittrich, M.-A.^{Aff1, Aff3}, Malek, T.^{Aff1, Aff3, IDs11740022011574_cor3}, Sleiman, K.^{Aff2, Aff3}, Rettschlag, K.^{Aff2, Aff3}, Jäschke, P., Kaierle, S.^{Aff2, Aff3}

المصدر: Production Engineering: Research and Development. 17(3-4):381-390

المؤلفون: Yost, S. A., Dittrich, M., Jadach, S., Wąs, Z., Ward, B. F. L.

المصدر: SciPost Phys. Proc. 7, 016 (2022)

مصطلحات موضوعية: High Energy Physics - Phenomenology

URL الوصول: http://arxiv.org/abs/2111.14567

المؤلفون: Wetzel, A.W., Bakal, J., Dittrich, M., Hildebrand, D.G.C., Morgan, J.L., Lichtman, J.W.

المصدر: 2016 IEEE Applied Imagery Pattern Recognition Workshop (AIPR) Applied Imagery Pattern Recognition Workshop (AIPR), 2016 IEEE. :1-10 Oct, 2016

Relation: 2016 IEEE Applied Imagery Pattern Recognition Workshop (AIPR)

المؤلفون: Denkena, B.^Aff16, Dittrich, M.-A.^Aff16, Settnik, S. J.^Aff16

المساهمون: Cavas-Martínez, Francisco, Series Editor^Aff1, Chaari, Fakher, Series Editor^Aff2, di Mare, Francesca, Series Editor^Aff3, Gherardini, Francesco, Series Editor^Aff4, Haddar, Mohamed, Series Editor^Aff5, Ivanov, Vitalii, Series Editor^Aff6, Kwon, Young W., Series Editor^Aff7, Trojanowska, Justyna, Series Editor^Aff8, Andersen, Ann-Louise, editor^Aff9, Andersen, Rasmus, editor^Aff10, Brunoe, Thomas Ditlev, editor^Aff11, Larsen, Maria Stoettrup Schioenning, editor^Aff12, Nielsen, Kjeld, editor^Aff13, Napoleone, Alessia, editor^Aff14, Kjeldgaard, Stefan, editor^Aff15

المصدر: Towards Sustainable Customization: Bridging Smart Products and Manufacturing Systems : Proceedings of the 8th Changeable, Agile, Reconfigurable and Virtual Production Conference (CARV2021) and the 10th World Mass Customization & Personalization Conference (MCPC2021), Aalborg, Denmark, October/November 2021. :603-611

المؤلفون: Wojnowski, M., Pressel, K., Beer, G., Heinig, A., Dittrich, M., Wolf, J.

المصدر: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th. :122-127 Dec, 2014

Relation: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Schaper, F.^Aff6, Denkena, B.^Aff6, Dittrich, M.-A.^Aff6, Krödel, A.^Aff6, Matthies, J.^Aff6, Worpenberg, S.^Aff6

المساهمون: Behrens, Bernd-Arno, editor^Aff1, Brosius, Alexander, editor^Aff2, Hintze, Wolfgang, editor^Aff3, Ihlenfeldt, Steffen, editor^Aff4, Wulfsberg, Jens Peter, editor^Aff5

المصدر: Production at the leading edge of technology : Proceedings of the 10th Congress of the German Academic Association for Production Technology (WGP), Dresden, 23-24 September 2020. :275-283

المؤلفون: Schoch, C.^Aff1, Dittrich, M., Geyer, M.

المصدر: Obere Extremität: Schulter · Ellenbogen. 16(3):182-191

المؤلفون: Denkena, B., Dittrich, M.-A., Noske, H., Stoppel, D., Lange, D.

المصدر: In CIRP Journal of Manufacturing Science and Technology November 2021 35:795-802

المؤلفون: Hoymann, C., Dittrich, M., Goebbels, S.

المصدر: 2007 IEEE Mobile WiMAX Symposium Mobile WiMAX Symposium, 2007. IEEE. :150-157 Mar, 2007

Relation: 2007 IEEE Mobile WiMAX Symposium

المؤلفون: Dittrich, M.-A., Denkena, B., Wichmann, M.

المصدر: In Procedia CIRP 2021 102:381-386