المؤلفون: Mun, Seongmi^Aff13, Do, Gilhwan^Aff14, Lee, Kwangil^Aff15

المساهمون: Kacprzyk, Janusz, Series Editor^Aff1, Gomide, Fernando, Advisory Editor^Aff2, Kaynak, Okyay, Advisory Editor^Aff3, Liu, Derong, Advisory Editor^Aff4, Pedrycz, Witold, Advisory Editor^Aff5, Polycarpou, Marios M., Advisory Editor^Aff6, Rudas, Imre J., Advisory Editor^Aff7, Wang, Jun, Advisory Editor^Aff8, Yang, Xin-She, editor^Aff9, Sherratt, R. Simon, editor^Aff10, Dey, Nilanjan, editor^Aff11, Joshi, Amit, editor^Aff12

المصدر: Proceedings of Eighth International Congress on Information and Communication Technology : ICICT 2023, London, Volume 1. 693:551-557

المؤلفون: Ji, Younggeun, Kim, Jeonghoon, Kim, Jungin, Lee, Miji, Noh, Jaeheon, Jeong, Taeyoung, Shin, Juhyeon, Kim, Junho, Heo, Young, Cho, Ung, Sagong, Hyunchul, Park, Junekyun, Choo, Yeonsik, Do, Gilhwan, Kang, Hoyoung, Choi, Eunkyeong, Sun, Dongyoon, Kang, Changki, Shin, Sangchul, Pae, Sangwoo

المصدر: 2018 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2018 IEEE International. :3D.3-1-3D.3-4 Mar, 2018

Relation: 2018 IEEE International Reliability Physics Symposium (IRPS)