المؤلفون: Lou, D., He, A., Redding, M., Geitz, M., Toth, R., Doring, R., Carson, R., Kuang, R.

المصدر: IEEE Access Access, IEEE. 10:107066-107076 2022

المؤلفون: Dudek, R., Hildebrandt, M., Kreysig, K., Rzepka, S., Doring, R., Scheiter, L., Zhang, M., Ortmann, R. W.

المصدر: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020 21st International Conference on. :1-8 Jul, 2020

Relation: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Dudek, R., Hildebrandt, M., Kreysig, K., Rzepka, S., Doring, R., Seiler, B., Fries, Th., Zhang, M., Ortmann, R. W.

المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :173-179 Dec, 2018

Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Dudek, R., Doring, R., Rzepka, S., Herberholz, T., Feil, D., Seiler, B., Scheiter, L., Schellenberg, C., Fritzsche, S.

المصدر: 2018 7th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2018 7th. :1-6 Sep, 2018

Relation: 2018 7th Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Dudek, Rainer, Doring, R., Otto, A., Rzepka, S., Stegmeier, S., Kiefl, S., Lunding, A., Eisele, R.

المصدر: 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017 16th IEEE Intersociety Conference on. :1145-1152 May, 2017

Relation: 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Dudek, R., Hildebrand, M., Rzepka, S., Beintner, J., Doring, R., Scheiter, L., Seiler, B., Fries, Th., Ortmann, R. W.

المصدر: 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on. :1-9 Apr, 2017

Relation: 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Dudek, R., Doring, R., Hildebrandt, M., Rzepka, S., Stegmeier, S., Kiefl, S.

المصدر: 2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-8 Sep, 2016

Relation: 2016 6th Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Dudek, R., Doring, R., Rzepka, S., Ehrhardt, C., Hutter, M., Rudzki, J., Osterwald, F., Eisele, R., Stegmeier, S., Weidner, K., Rittner, M.

المصدر: 2015 European Microelectronics Packaging Conference (EMPC) Microelectronics Packaging Conference (EMPC), 2015 European. :1-8 Sep, 2015

Relation: 2015 European Microelectronics Packaging Conference (EMPC)

المؤلفون: Dudek, R., Doring, R., Rzepka, S., Ehrhardt, C., Gunther, M., Haag, M.

المصدر: 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on. :1-8 Apr, 2015

Relation: 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Dudek, R., Doring, R., Sommer, P., Seiler, B., Kreyssig, K., Walter, H., Becker, M., Gunther, M.

المصدر: 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on. :1-9 Apr, 2014

Relation: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)