المؤلفون: Dudek, Rainer, Doring, Ralf, Kreysig, Kerstin, Rzepka, Sven, Fruehauf, Peter, Weigert, Andreas

المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-13 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Dudek, Rainer, Otto, Alexander, Doring, Ralf, Mathew, Anu, Liu, Xing, Rzepka, Sven

المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-11 Apr, 2023

Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Vandevelde, Bart, Nawghane, Chinmay, Dudek, Rainer, Doring, Ralf, Schindele, Jens, Gromala, Przemyslaw

المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-7 Apr, 2022

Relation: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Dudek, Rainer, Doring, Ralf, Mathew, Anu, Otto, Alexander, Rzepka, Sven

المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-11 Apr, 2022

Relation: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Dudek, Rainer, Doring, Ralf, Rzepka, Sven, Gromala, Przemyslaw, Schindele, Jens, Vandevelde, Bart

المصدر: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021 22nd International Conference on. :1-12 Apr, 2021

Relation: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Dudek, Rainer, Hildebrandt, Marcus, Rzepka, Sven, Doring, Ralf, Scheiter, Lutz, Troger, Bastian, Zhang, Mengjia, Ortmann, Reinhold W.

المصدر: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019 20th International Conference on. :1-9 Mar, 2019

Relation: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Dudek, Rainer, Doring, Ralf, Hildebrandt, Marcus, Rzepka, Sven, Stegmeier, Stefan, Kiefl, Stefan, Sommer, Volkmar, Mitic, Gerhard, Weidner, Karl

المصدر: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on. :1-8 Apr, 2016

Relation: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Gabler, F., Roscher, F., Doring, Ralf, Otto, A., Ziesche, S., Ihle, M., Celik, Y., Dietz, D., Goehlich, A., Kappert, H., Vogt, H., Naumann, F., Gessner, T.

المصدر: 2016 China Semiconductor Technology International Conference (CSTIC) Semiconductor Technology International Conference (CSTIC), 2016 China. :1-4 Mar, 2016

Relation: 2016 China Semiconductor Technology International Conference (CSTIC)

المؤلفون: Dudek, Rainer, Sommer, Peter, Doring, Ralf, Herberholz, Timo, Fix, Andreas, Seiler, Bettina, Rzepka, Sven

المصدر: Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on. :912-919 May, 2014

Relation: 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Ulrich, Clara, Catchpole, Thomas, Curtis, Hazel, Daskalov, Georgi, Doring, Ralf, Gascuel, Didier, Knittweis, Leyla, Lloret, Josep, Malvarosa, Loretta, Martín, Paloma, Motova, Arina, Murua, Hilario, Nord, Jenny, Prellezo, Raul, Raid, Tiit, Sabatella, Evelina, Sala, Antonello, Scarcella, Giuseppe, Soldo, Alen, Somarakis, Stylianos, Stransky, Christoph, Van Hoof, Luc

المساهمون: Technical University of Denmark [Lyngby] (DTU), Centre for Environment, Fisheries and Aquaculture Science [Lowestoft] (CEFAS), Bulgarian Academy of Sciences (BAS), Thünen Institute, Écologie et santé des écosystèmes (ESE), AGROCAMPUS OUEST, Institut national d'enseignement supérieur pour l'agriculture, l'alimentation et l'environnement (Institut Agro)-Institut national d'enseignement supérieur pour l'agriculture, l'alimentation et l'environnement (Institut Agro)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE), Faculty of Science, Department of Biology (UNIVERSITY OF MALTA), University of Malta [Malta], INSTITUTE OF AQUATIC ECOLOGY UNIVERSITY OF GIRONA GIRONA ESP, Partenaires IRSTEA, Institut national de recherche en sciences et technologies pour l'environnement et l'agriculture (IRSTEA)-Institut national de recherche en sciences et technologies pour l'environnement et l'agriculture (IRSTEA), Fishery and Aquaculture Research Organisation (NISEA), CSIC Instituto de Ciencias del Mar, Sea Fish Industry Authority, Sea Fish Industry Authorit, AZTI - Tecnalia, The Swedish Agency of Marine and Water Management (SwAM), unidad des Investigacion Marina, AZTI, Estonian Marine Institute, University of Tartu, Istituto di Science Marine (ISMAR ), Consiglio Nazionale delle Ricerche (CNR), University of Split, HELLENIC CENTRE FOR MARINE RESEARCH INSITUTE OF MARINE BIOLOGICAL RESOURCES AND INLAND WATERS ATTICA, GRC, European Commission, Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE)-AGROCAMPUS OUEST, Institut national d'enseignement supérieur pour l'agriculture, l'alimentation et l'environnement (Institut Agro)-Institut national d'enseignement supérieur pour l'agriculture, l'alimentation et l'environnement (Institut Agro)

المصدر: European Commission. 2019, 978-92-76-02904-5. ⟨10.2760/56785⟩

مصطلحات موضوعية: Shark fisheries, Shark finning regulation, [SDV.SA.STP]Life Sciences [q-bio]/Agricultural sciences/Sciences and technics of fishery, Fisheries, Shark conservation, European commission, ComputingMilieux_MISCELLANEOUS

URL الوصول: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::85eadc5b7469d517f844fcd694dfa81e
https://hal-agrocampus-ouest.archives-ouvertes.fr/hal-02635465/file/KJAX19001ENN.en.pdf