المؤلفون: Cao, B., Zhang, Z., Yin, W., Wang, D.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(3):3266-3276 Feb, 2024

المؤلفون: Qu, Z., Wang, W., Yang, S., Sun, Q., Fang, Z., Zheng, Y.

المصدر: IEEE Access Access, IEEE. 7:75330-75341 2019

المؤلفون: Zilian Qu, Wensong Wang, Shuhui Yang, Quqin Sun, Zhongyuan Fang, Yuanjin Zheng

المصدر: IEEE Access, Vol 7, Pp 75330-75341 (2019)

مصطلحات موضوعية: Double-coil sensor, magnetic resonance coupling, Cu film on the silicon wafer, stress free polishing, equivalent circuit model, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/8731890/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/0c5c459333864fffb2bb24abffd72905

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المؤلفون: Shuhui Yang, Wensong Wang, Yuanjin Zheng, Quqin Sun, Zilian Qu, Zhongyuan Fang

المساهمون: School of Electrical and Electronic Engineering, SMRT-NTU Smart Urban Rail Corporate Laboratory

المصدر: IEEE Access, Vol 7, Pp 75330-75341 (2019)

مصطلحات موضوعية: Materials science, General Computer Science, Silicon, chemistry.chemical_element, Polishing, Magnetic Resonance Coupling, law.invention, law, Cu film on the silicon wafer, Eddy current, General Materials Science, Wafer, business.industry, General Engineering, Inductance, Double-coil sensor, chemistry, magnetic resonance coupling, equivalent circuit model, Electromagnetic coil, Double-coil Sensor, Electrical and electronic engineering [Engineering], Equivalent circuit, Optoelectronics, lcsh:Electrical engineering. Electronics. Nuclear engineering, Coaxial, business, lcsh:TK1-9971, stress free polishing

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5c5c35b525ccc000143dedd2a54e9512
https://ieeexplore.ieee.org/document/8731890/