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المؤلفون: Chang Chih-Yang, T. L. Shao, Doug C. H. Yu, J. Y. Wang, Chung-Jung Wu, W. H. Lin, C. H. Tung, S. T. Hsiao
المصدر: VLSI Circuits
مصطلحات موضوعية: Very-large-scale integration, Fusion, Materials science, Silicon, business.industry, Thermal resistance, chemistry.chemical_element, Chip, chemistry, Trench, Water cooling, Optoelectronics, business, Power density
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0f94e6c01c773a34aaa3564af8db4029
https://doi.org/10.23919/vlsicircuits52068.2021.9492489 -
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المؤلفون: K. C. Yee, Hung-Chi Li, Terry Ku, Hung Jeng-Nan, C.H. Yu, Doug C. H. Yu, Po-Fan Lin
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Thermal design power, Computer cooling, business.industry, Computer science, Thermal resistance, Electrical engineering, Bandwidth (computing), Data center, Thermal grease, High Bandwidth Memory, business, Supercomputer
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7887771017c10b9c9e5e5c845e16c865
https://doi.org/10.1109/ectc32696.2021.00029 -
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المؤلفون: Kuo-Chung Yee, Doug C. H. Yu
المصدر: 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).
مصطلحات موضوعية: Computer architecture, Computer science, business.industry, Bandwidth (signal processing), Integration platform, System integration, Cloud computing, Enhanced Data Rates for GSM Evolution, Latency (engineering), business, Supercomputer, Database-centric architecture
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::42ea96b6bbaf651e7a716afbf82d465c
https://doi.org/10.1109/vlsi-tsa48913.2020.9203661 -
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المؤلفون: Wu Kai-Chiang, Kun-You Lin, C.H. Tsai, Che-Wei Hsu, Lu Chun-Lin, H. Wang, C. T. Wang, Doug C. H. Yu, K. Y. Kao, C. S. Liu, Tang Tzu-Chun, Tzong-Lin Wu, Pu Han-Ping
المصدر: 2019 IEEE International Electron Devices Meeting (IEDM).
مصطلحات موضوعية: Beamforming, Materials science, business.industry, Bandwidth (signal processing), 020206 networking & telecommunications, 02 engineering and technology, law.invention, Front and back ends, Antenna array, CMOS, law, Extremely high frequency, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Dipole antenna, business, Electronic circuit
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b78780a82f2cd3aa0d37cb2e6073fe2e
https://doi.org/10.1109/iedm19573.2019.8993591 -
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المؤلفون: Wu Kai-Chiang, Chung-Hao Tsai, Tang Tzu-Chun, Doug C. H. Yu, Chung-Shi Liu, Che-Wei Hsu, Chuei-Tang Wang, Pu Han-Ping, Chia-Chia Lin, Lu Chun-Lin
المصدر: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS).
مصطلحات موضوعية: Inductance, Coupling, Materials science, business.industry, Q factor, Optoelectronics, Solenoid, Redistribution layer, Molding (process), business, Inductor, Rf system
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1c5ab65c83e3becf688654525e1270b8
https://doi.org/10.1109/edaps47854.2019.9011648 -
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المؤلفون: Wen-Chih Chiou, Clark Hu, Doug C. H. Yu, M. F. Chen
المصدر: 2019 Symposium on VLSI Technology.
مصطلحات موضوعية: 010302 applied physics, Leading edge, Computer science, 020209 energy, Small Outline Integrated Circuit, 02 engineering and technology, Chip, 01 natural sciences, Line (electrical engineering), 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, High bandwidth, Electrical efficiency
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9a5a4594ea6c100f054a28ed0539d2c8
https://doi.org/10.23919/vlsit.2019.8776486 -
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المؤلفون: Ming-Fa Chen, Fang-Cheng Chen, W. C. Chiou, Doug C. H. Yu
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Packaging engineering, business.industry, Computer science, 020208 electrical & electronic engineering, Small Outline Integrated Circuit, Power integrity, 02 engineering and technology, Chip, 01 natural sciences, Embedded system, 0103 physical sciences, Scalability, 0202 electrical engineering, electronic engineering, information engineering, Interposer, Signal integrity, business, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7fb24d4881612c262d70f3ba93fde9ca
https://doi.org/10.1109/ectc.2019.00095 -
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المؤلفون: Jeng-Shien Hsieh, C.H. Yu, Doug C. H. Yu, Liang-Ju Yen, Hsieh Ching-Hua, Cheng-chieh Hsieh, Chang Wang, C. S. Liu, Victor C. Y. Chang, K. C. Yee
المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Interconnection, Fabrication, Materials science, business.industry, 010401 analytical chemistry, Copper interconnect, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, 0104 chemical sciences, law.invention, law, Chemical-mechanical planarization, Optoelectronics, Wafer, Photolithography, 0210 nano-technology, business, Lithography, Data transmission
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1e4bb3968add83d6a034710cf5c468b7
https://doi.org/10.1109/ectc.2018.00093 -
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المؤلفون: Doug C. H. Yu, Chih Chen, Kuan-Neng Chen
المصدر: MRS Bulletin. 40:257-263
مصطلحات موضوعية: Materials science, Soldering, Intermetallic, Electronic packaging, General Materials Science, Wetting, Physical and Theoretical Chemistry, Composite material, Condensed Matter Physics, Porosity, Electromigration, Joint (geology), Necking
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المؤلفون: Victor C. Y. Chang, Kai-Yuan Ting, Shang-Yun Hou, Vincent Wei, T. H. Yu, Doug C. H. Yu, C. T. Wang, Chun-Yu Wu, S. Y. Huang, W. Chris Chen, Clark Hu
المصدر: 2017 Symposium on VLSI Technology.
مصطلحات موضوعية: 010302 applied physics, Engineering, business.industry, 020208 electrical & electronic engineering, Process (computing), Three-dimensional integrated circuit, 02 engineering and technology, High Bandwidth Memory, Supercomputer, 01 natural sciences, Image stitching, Reliability (semiconductor), 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Interposer, Electronic engineering, Wafer, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::669fb8fbd4dd06329048899bd8c9a695
https://doi.org/10.23919/vlsit.2017.7998198