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1مؤتمر
المؤلفون: Luo, Kai, Li, Chen, Santi, Enrico
المصدر: 2023 IEEE Electric Ship Technologies Symposium (ESTS) Electric Ship Technologies Symposium (ESTS), 2023 IEEE. :337-342 Aug, 2023
Relation: 2023 IEEE Electric Ship Technologies Symposium (ESTS)
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2دورية أكاديمية
المؤلفون: Mostafazadeh, Nima, Faraji, MasoudAff1, IDs1080002402185x_cor2
المصدر: Journal of Applied Electrochemistry. :1-15
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3دورية أكاديمية
المؤلفون: Nanou, Paraskevi, Zarkadoulas, Athanasios, Pandis, Pavlos K.Aff1, Aff2, Tsilikas, IoannisAff3, Aff4, Katis, Ilias, Almpani, Despoina, Orfanoudakis, Nikolaos, Vourdas, Nikolaos, Stathopoulos, VassilisAff1, Aff2, IDs0017002413701w_cor9
المصدر: The International Journal of Advanced Manufacturing Technology. 133(1-2):307-319
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4دورية أكاديمية
المؤلفون: Lam, Cheuk, Donati, Matteo, Regulagadda, Kartik, Yavuz, Emre, Pfeiffer, Till, Sarkiris, Panagiotis, Gogolides, Evangelos, Milionis, Athanasios, Poulikakos, Dimos, Butt, Hans-Jürgen, Kappl, Michael, Li, Shuai
المصدر: ACS Applied Materials and Interfaces. 16(1)
مصطلحات موضوعية: dropwise condensation, durability, heat transfer, polydimethylsiloxane, transition, wetting
وصف الملف: application/pdf
URL الوصول: https://escholarship.org/uc/item/4ch2b65m
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5كتاب إلكتروني
المؤلفون: Raza, WaquarAff14, Aff14, Narayanaswamy, RameshAff15, Muralidhar, K.Aff14
المساهمون: Chaari, Fakher, Series EditorAff1, Gherardini, Francesco, Series EditorAff2, Ivanov, Vitalii, Series EditorAff3, Haddar, Mohamed, Series EditorAff4, Cavas-Martínez, Francisco, Editorial Board MemberAff5, di Mare, Francesca, Editorial Board MemberAff6, Kwon, Young W., Editorial Board MemberAff7, Trojanowska, Justyna, Editorial Board MemberAff8, Xu, Jinyang, Editorial Board MemberAff9, Singh, Krishna Mohan, editorAff10, Dutta, Sushanta, editorAff11, Subudhi, Sudhakar, editorAff12, Singh, Nikhil Kumar, editorAff13
المصدر: Fluid Mechanics and Fluid Power, Volume 5 : Select Proceedings of FMFP 2022. :361-374
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6كتاب إلكتروني
المؤلفون: Volk, Marie-ChristineAff18, Niehaus, KonstantinAff19, Aff20, Westhoff, AndreasAff19, Wagner, ClausAff19, Aff20
المساهمون: Hirschel, Ernst Heinrich, Founding EditorAff1, Schröder, Wolfgang, Series EditorAff2, Boersma, Bendiks Jan, Editorial Board MemberAff3, Fujii, Kozo, Editorial Board MemberAff4, Haase, Werner, Editorial Board MemberAff5, Leschziner, Michael A., Editorial Board MemberAff6, Periaux, Jacques, Editorial Board MemberAff7, Pirozzoli, Sergio, Editorial Board MemberAff8, Rizzi, Arthur, Editorial Board MemberAff9, Roux, Bernard, Editorial Board MemberAff10, Shokin, Yurii I., Editorial Board MemberAff11, Lagemann, Esther, Managing EditorAff12, Dillmann, Andreas, editorAff13, Heller, Gerd, editorAff14, Krämer, Ewald, editorAff15, Wagner, Claus, editorAff16, Weiss, Julien, editorAff17
المصدر: New Results in Numerical and Experimental Fluid Mechanics XIV : Contributions to the 23rd STAB/DGLR Symposium, Berlin, Germany, 2022. 154:579-589
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7دورية أكاديمية
المؤلفون: Chattoraj, TridibeshAff1, IDs1204602402478z_cor1, Chatterjee, AvishekAff1, IDs1204602402478z_cor2, Thomas, Tibin M, Mahapatra, Pallab SinhaAff2, IDs1204602402478z_cor4, Mukhopadhyay, AchintyaAff1, IDs1204602402478z_cor5
المصدر: Sādhanā: Published by the Indian Academy of Sciences. 49(2)
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8مؤتمر
المصدر: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :1015-1023 Jun, 2021
Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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9دورية أكاديمية
المؤلفون: Azarifar, M., Budakli, M., Basol, A.M., Arik, M.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(10):1668-1678 Oct, 2021
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10دورية أكاديمية
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