المؤلفون: Lien, Yi-Wei, Peng, Sheng-Wen, Lin, Che-Kai, Du, Jhih-Han, Hsieh, Yun-Ting, Tseng, Andy, Wang, Wei-Chou, Chou, Tung-Yao, Lin, Wayne, Jhan, Richard, Huang, Clement, Takatani, Shinichiro, Wohlmuth, Walter

المصدر: 2017 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS) Microwaves, Antennas, Communications and Electronic Systems (COMCAS), 2017 IEEE International Conference on. :1-5 Nov, 2017

Relation: 2017 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)

المؤلفون: Wohlmuth, Walter, Weng, Ming-Hung, Lin, Che-Kai, Du, Jhih-Han, Ho, Shin-Yi, Chou, Tung-Yao, Li, Shuan-Ming, Huang, Clement, Wang, Wei-Chou, Wang, Wen-Kai

المصدر: 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS 2013) Microwaves, Communications, Antennas and Electronics Systems (COMCAS), 2013 IEEE International Conference on. :1-4 Oct, 2013

Relation: 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS)

المؤلفون: Weng, Ming-Hung, Lin, Che-Kai, Du, Jhih-Han, Wang, Wei-Chou, Wang, Wen-Kai, Wohlmuth, Walter

المصدر: 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) Compound Semiconductor Integrated Circuit Symposium (CSICS), 2013 IEEE. :1-4 Oct, 2013

Relation: 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

المؤلفون: Lin, Che-Kai, Du, Jhih-Han, Wang, Albert, Peng, Sheng-Wen, Chen, Chao-Hung, Chen, Chai-Hao, Chou, Tung-Yao, Wang, Wei-Chou, Wu, Jya-Shian, Kuo, Richard, Huang, Clement, Cho, I-Te, Wohlmuth, Walter, Takatani, Shinichiro

المصدر: 2014 Asia-Pacific Microwave Conference Microwave Conference (APMC), 2014 Asia-Pacific. :188-190 Nov, 2014

Relation: 2014 Asia-Pacific Microwave Conference (APMC)

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المؤلفون: Wang, Yao Hsien, Chen, Chao Hao, Chang, Yu Wei, Huang, Shih Hui, Wei, Yi Feng, Weng, Ming Hung, Du, Jhih Han, Wang, Wei Chou, Cho, I Te, Wohlmuth, Walter

المصدر: Materials Science Forum; June 2015, Vol. 821 Issue: 1 p995-998, 4p

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