يعرض 1 - 10 نتائج من 246 نتيجة بحث عن '"Du, Zhengwei"', وقت الاستعلام: 0.84s تنقيح النتائج
  1. 1
    مؤتمر
    Glass Insulator Fault Identification Method Based on Improved YOLOv5

    المؤلفون: Xue, Rui, Du, Zhengwei, Duan, Jialu

    المصدر: 2022 6th International Conference on Communication and Information Systems (ICCIS) Communication and Information Systems (ICCIS), 2022 6th International Conference on. :148-152 Oct, 2022

    Relation: 2022 6th International Conference on Communication and Information Systems (ICCIS)

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  2. 2
    مؤتمر
    Influence of Microwave Pulse Power on The Burnout Effect of The AlGaN/GaN HEMT in a LNA

    المؤلفون: Liu, Ling, Du, Zhengwei

    المصدر: 2019 IEEE 6th International Symposium on Electromagnetic Compatibility (ISEMC) Electromagnetic Compatibility (ISEMC), 2019 IEEE 6th International Symposium on. :1-5 Nov, 2019

    Relation: 2019 IEEE 6th International Symposium on Electromagnetic Compatibility (ISEMC)

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  3. 3
    مؤتمر
    A Low-profile Broadband Balun Fed Circular Patch Antenna

    المؤلفون: Cheng, Bo, Du, Zhengwei

    المصدر: 2019 IEEE 6th International Symposium on Electromagnetic Compatibility (ISEMC) Electromagnetic Compatibility (ISEMC), 2019 IEEE 6th International Symposium on. :1-4 Nov, 2019

    Relation: 2019 IEEE 6th International Symposium on Electromagnetic Compatibility (ISEMC)

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  4. 4
    دورية أكاديمية
    MPE-DETR: A multiscale pyramid enhancement network for object detection in low-light images

    المؤلفون: Xue, Rui, Duan, Jialu, Du, Zhengwei

    المصدر: In Image and Vision Computing October 2024 150

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  5. 5
    دورية أكاديمية
    Interactions between the gut bacterial community of Exopalaemon carinicauda and infection by Enterocytozoon hepatopenaei

    المؤلفون: Li, Wanying, Hua, Songsong, Du, Zhengwei, Jiang, Haiyi, Jiang, Shanshan, Yu, Miaomiao, Ali Baloch, Wazir, Noonari, Sumera, Yan, Binlun, Gao, Huan

    المصدر: In Journal of Invertebrate Pathology June 2024 204

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  6. 6
    مؤتمر
    Influence of microwave pulse parameters on the burnout effect of an LNA constructed by a GaAs PHEMT

    المؤلفون: Yi, Shipeng, Du, Zhengwei

    المصدر: 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing) Electromagnetic Compatibility (EMC-Beijing), 2017 IEEE 5th International Symposium on. :1-4 Oct, 2017

    Relation: 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing)

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  7. 7
    مؤتمر
    Burnout effects of microwave pulses on the AlGaN/GaN HEMT in an LNA

    المؤلفون: Xiong, Siyu, Du, Zhengwei

    المصدر: 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing) Electromagnetic Compatibility (EMC-Beijing), 2017 IEEE 5th International Symposium on. :1-5 Oct, 2017

    Relation: 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing)

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  8. 8
    مؤتمر
    Combined FEM-reaction method for EMS analysis of a PCB in a low-Q enclosure

    المؤلفون: Li, Xuelian, Du, Zhengwei

    المصدر: 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing) Electromagnetic Compatibility (EMC-Beijing), 2017 IEEE 5th International Symposium on. :1-4 Oct, 2017

    Relation: 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing)

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  9. 9
    مؤتمر
    Applications of a reciprocity-based hybrid approach on EMS analysis of embedded planar capacitors and PG vias in multilayer PCBs

    المؤلفون: Li, Xuelian, Du, Zhengwei

    المصدر: 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing) Electromagnetic Compatibility (EMC-Beijing), 2017 IEEE 5th International Symposium on. :1-4 Oct, 2017

    Relation: 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing)

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  10. 10
    مؤتمر
    SPICE model for analyzing EMS responses of multilayer PCBs with nonlinear loads

    المؤلفون: Li, Xuelian, Du, Zhengwei

    المصدر: 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing) Electromagnetic Compatibility (EMC-Beijing), 2017 IEEE 5th International Symposium on. :1-4 Oct, 2017

    Relation: 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing)

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