المؤلفون: Renaud, Pablo, Dubarry, Christophe, Bresson, Nicolas, Deschaseaux, Edouard, Fournel, Frank, Morales, Christophe, Abadie, Karine, Thomas, Candice, Charbonnier, Jean

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :441-446 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Dubarry, Matthieu, Yasir, Fahim

المصدر: 2024 IEEE Electrical Energy Storage Application and Technologies Conference (EESAT) Electrical Energy Storage Application and Technologies Conference (EESAT), 2024 IEEE. :1-5 Jan, 2024

Relation: 2024 IEEE Electrical Energy Storage Application and Technologies Conference (EESAT)

المؤلفون: Lucci, Luca, Valorge, Olivier, Oliviera, Alexandre, Boutry, Herve, Dubarry, Christophe, Gaillard, Fred, Duriez, Blandine

المصدر: 2024 IEEE 24th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 2024 IEEE 24th Topical Meeting on. :48-51 Jan, 2024

Relation: 2024 IEEE 24th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)

المؤلفون: Oliveira, A., Valorge, O., Dubarry, C., Roelens, Y., Zaknoune, M., Lugo-Alvarez, J.

المصدر: 2023 53rd European Microwave Conference (EuMC) Microwave Conference (EuMC), 2023 53rd European. :616-619 Sep, 2023

Relation: 2023 53rd European Microwave Conference (EuMC)

المؤلفون: Roulleau, Lea, Vauche, Laura, Valorge, Olivier, Dubarry, Christophe, Cioccio, Lea Di

المصدر: 2023 18th European Microwave Integrated Circuits Conference (EuMIC) Microwave Integrated Circuits Conference (EuMIC), 2023 18th European. :390-393 Sep, 2023

Relation: 2023 18th European Microwave Integrated Circuits Conference (EuMIC)

المؤلفون: Dubarry, C., Arnaud, L., Munoz, M. L. Calvo, Mauguen, G., Moreau, S., Crochemore, R., Bresson, N., Aventurier, B.

المصدر: 2021 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2021 IEEE International. :1-4 Oct, 2021

Relation: 2021 IEEE International 3D Systems Integration Conference (3DIC)

المؤلفون: Wesley Chang, Matthieu Dubarry, Jeffrey S. Lowe, Shannon Reed

المصدر: iScience, Vol 27, Iss 6, Pp 109739- (2024)

مصطلحات موضوعية: Science

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2589004224009611; https://doaj.org/toc/2589-0042

URL الوصول: https://doaj.org/article/c90d6cb9576246399b89a4f65f8787d5

المؤلفون: Penzo, Arianna, Dubarry, Marion^{Aff2, Aff6}, Brocas, Clémentine, Zheng, Myriam, Mangione, Raphaël M., Rougemaille, Mathieu, Goncalves, Coralie, Lautier, Ophélie, Libri, Domenico, Simon, Marie-Noëlle, Géli, Vincent, Dubrana, Karine, Palancade, Benoit^{Aff1, IDs4146702341345z_cor13}

المصدر: Nature Communications. 14(1)

المؤلفون: Dubarry, Matthieu^{Aff1, IDs41467023388957_cor1}, Costa, Nahuel, Matthews, Dax

المصدر: Nature Communications. 14(1)

المؤلفون: Jouve, A., Lagoutte, E., Crochemore, R., Mauguen, G., Flahaut, T., Dubarry, C., Balan, V., Fournel, F., Bourjot, E., Servant, F., Scannell, M., Rohracher, K., Bodner, T., Faes, A., Hofrichter, J.

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :201-209 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)